Polishing / CMP Semiconductor Metrology Instruments Datasheets

from KLA-Tencor Corporation

The ASET-F5x thin film metrology system can measure materials across a continuous wavelength spectrum from 190 nm to 800 nm —a critical feature for meeting the stringent thin film measurement requirements down to 0.1 micron geometries. Accurate measurements of complex multi-layer thin film... [See More]

  • Applications: Wafer; CVD / PVD; Polishing / CMP; Photolithography
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: Ellipsometer
Metrology System -- Z3D-7000 Series
from Zygo Corporation

Simultaneously measures multiple parameters [See More]

  • Applications: Wafer; CVD / PVD; Electroplate; Polishing / CMP; Photolithography; Bumping Processes
  • Mounting / Loading: In-line; Floor
  • Form Factor: Monitor or instrument
  • Technology: Profilometer or AFM; Optical / Imaging; Interferometer