Polishing / CMP Semiconductor Metrology Instruments Datasheets

from KLA-Tencor Corporation

The ASET-F5x thin film metrology system can measure materials across a continuous wavelength spectrum from 190 nm to 800 nm —a critical feature for meeting the stringent thin film measurement requirements down to 0.1 micron geometries. Accurate measurements of complex multi-layer thin film... [See More]

  • Applications: Wafer; CVD / PVD; Polishing / CMP; Photolithography
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: Ellipsometer
Thin-Film Measuring Systems -- TF Series
from StellarNet, Inc.

TF Systems for Non-Contact Film Thickness Measurements. We offer a complete line of film thickness measurement systems that can measure from 5 nm to 200 ┬Ám for analysis of single layer and/or multilayer films in less than a second. StellarNet thin film reflectometry systems consist of a portable USB... [See More]

  • Applications: Wafer (optional feature); CVD / PVD (optional feature); Polishing / CMP (optional feature); Polymer or photoresist films (optional feature); Thin-Film Photovoltaics
  • Technology: Reflectometer
  • Form Factor: Monitor or instrument
  • Measurements: FilmThickness (optional feature); WaferThickness (optional feature)