from Bruker Nano Surfaces Division
The ContourGT InMotion 3D Optical Microscope provides the most reliable and detailed surface characterization of dynamic MEMS and other micro-devices in operation. Utilizing white light interferometry, the ContourGT InMotion performs three-dimensional surface measurements of features from 0.1nm to... [See More]
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM; Optical / Imaging; Interferometer
- Mounting / Loading: Manual loading
- Applications: Wafer; Ophthalmic Lenses, MEMS, Solar Cells
from Filmetrics, Inc.
Automated Cassette-to-Cassette Thin-Film Thickness Mapping System for Production Environments. The Filmetrics F60-c family maps film thickness and index just like our F50 products, but it also includes a number of features intended specifically for production environments. These include automatic... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer; CVD / PVD
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); Spectral Reflectance
- Measurements: Area mapping
from MicroSense, LLC
The Polar Kerr System for MRAM utilizes the polar Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. Utilizing a non-contact full-wafer measurement technique, the system creates a map of... [See More]
- Form Factor: Monitor or instrument
- Technology: Magnetometer
- Mounting / Loading: Floor
- Applications: Wafer
from StellarNet, Inc.
TF Systems for Non-Contact Film Thickness Measurements. We offer a complete line of film thickness measurement systems that can measure from 5 nm to 200 µm for analysis of single layer and/or multilayer films in less than a second. StellarNet thin film reflectometry systems consist of a portable USB... [See More]
- Form Factor: Monitor or instrument
- Applications: Wafer (optional feature); CVD / PVD (optional feature); Polishing / CMP (optional feature); Polymer or photoresist films (optional feature); Thin-Film Photovoltaics
- Technology: Reflectometer
- Measurements: FilmThickness (optional feature); WaferThickness (optional feature)
from Corning Specialty Materials
Ideal for processes development, particularly for new, non-silicon material [See More]
- Form Factor: Monitor or instrument
- Technology: Interferometer
- Mounting / Loading: Floor
- Applications: Wafer
from KLA-Tencor Corporation
The KLA-Tencor 300 UV Series was the first reticle inspection family using UV illumination for the inspection of DUV reticles. With the higher resolution UV wavelength and new defect detection technology, the 300UV reticle inspection systems can inspect reticles with advanced design rules, critical... [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging; UV Inspection
- Mounting / Loading: Floor
- Applications: Photolithography
from Olympus America Inc.
The Olympus MX51 industrial inspection microscope is optimized for the inspection requirements of a variety of electronic components including semiconductor wafer inspection. Its compact size, ease of operation, 6"x6" stage travel and cost effectiveness make the MX51 an ideal inspection microscope... [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
- Mounting / Loading: In-line (optional feature); Manual loading
- Applications: Wafer
from Park Systems, Inc.
Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
- Mounting / Loading: Floor
- Applications: Wafer
from TELOPS, Inc.
The laser diode bar tester picks up each laser diode bar from the tape and measures LIV, wavelength and FFP characteristics for each die. [See More]
- Form Factor: Monitor or instrument; ProbingSystem
- Technology: Optical / Imaging; IV system or SMU; Wafer sorter or prober
- Mounting / Loading: Floor
- Applications: Packaged IC or substrate; Laser Diode Bar Tester
from ULVAC Technologies, Inc.
High resolution, high speed sampling, long life span [See More]
- Form Factor: Monitor or instrument; Controller
- Measurements: FilmThickness
- Applications: Wafer; CVD / PVD
- Features: Noncontact; Non-destructive
from WDI Wise Device Inc.
This is the only commercially available microscope guaranteeing transmission of more then 80% for all four YAG laser harmonics: 266, 355, 532, and 1064nm - without compromising the review channel fidelity. The MIC4 microscope is instrumental in laser repair of TFT arrays over the wavelength ranging... [See More]
- Form Factor: Monitor or instrument
- Technology: Optical / Imaging
- Mounting / Loading: Floor (optional feature)
- Applications: CVD / PVD; Electroplate; Packaged IC or substrate; Photolithography; PV Cell, Laser Micromachining, Photomask
from Xenemetrix Ltd.
EX-6600 SDD. Secondary Target EDXRF. Xenemetrix ’s EX-6600 SDD Energy Dispersive X-ray Fluorescence (EDXRF) spectrometer offers the ultimate in sensitivity and selectivity. The Silicon Drift Detector (SDD) simultaneously delivers lower electronic noise and higher count rates which translates... [See More]
- Form Factor: Monitor or instrument
- Technology: Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); EDXRF
- Mounting / Loading: Manual loading; Floor
- Applications: Wafer; CVD / PVD; Electroplate
from Zygo Corporation
Simultaneously measures multiple parameters [See More]
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM; Optical / Imaging; Interferometer
- Mounting / Loading: In-line; Floor
- Applications: Wafer; CVD / PVD; Electroplate; Polishing / CMP; Photolithography; Bumping Processes
