from Bruker Nano Surfaces Division
Dimension ™ X automated atomic force microscope replaces costly, destructive cross-sectioning techniques, cutting etch measurement time from days to minutes, to help you increase yield without sacrificing quality. The Dimension X is engineered to provide unequaled throughput of 25 WPH (five... [See More]
- Measurements: Critical dimensions or Trench geometry; Roughness / Waviness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
from NanoAndMore USA Corp.
The new NanoAndMore Tuning Fork Sensor Controller is an electronic device to control the self-oscillation of a quartz tuning fork based sensor and to measure its frequency. The new NanoAndMore Tuning Fork Sensor Controller offers our customers the convenience of a ready to use electronic device to... [See More]
- Measurements: Critical dimensions or Trench geometry; Flatness; Roughness / Waviness
- Mounting / Loading: Manual loading
- Form Factor: Controller
- Technology: Profilometer or AFM; SPM
from Hitachi High Technologies America, Inc.
The FB2200 allows for rapid and precise specimen preparation for both transmission and scanning electron microscopy of semiconductors and other advanced materials. High precision and high milling rates. The use of a new low aberration ion optical system allows a maximum beam current of 60nA at an... [See More]
- Measurements: Critical dimensions or Trench geometry; Flatness; FilmThickness
- Mounting / Loading: Floor
- Form Factor: ProbingSystem
- Technology: FIB
from KLA-Tencor Corporation
The Archer 100 optical overlay control system meets the stringent performance and cost-of-ownership (CoO) requirements for the most advanced design rules and immersion lithography. This fully extendible system satisfies today's tighter overlay budgets yet is designed to keep pace with increasingly... [See More]
- Measurements: Critical dimensions or Trench geometry
- Mounting / Loading: Floor
- Form Factor: ProbingSystem
- Technology: Optical / Imaging
from Park Systems, Inc.
Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]
- Measurements: Defects, dimples or film residues; Critical dimensions or Trench geometry; Roughness / Waviness
- Mounting / Loading: Floor
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM
from Zygo Corporation
Simultaneously measures multiple parameters [See More]
- Measurements: Critical dimensions or Trench geometry; FilmThickness; Roughness / Waviness; Area mapping; DepthProfiling; 3D Surface Metrology
- Mounting / Loading: In-line; Floor
- Form Factor: Monitor or instrument
- Technology: Profilometer or AFM; Optical / Imaging; Interferometer
