SigmaTech Wafer Metrology Systems -- UltraMap-TSV
from MicroSense, LLC

The SigmaTech UltraMap-TSV system is the world ’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer —up to 300mm in diameter. The UltraMap-TSV system can be offered in class-1... [See More]

  • Measurements: Critical dimensions or Trench geometry; TSV
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer
Focused Ion Beam System -- FB-2200
from Hitachi High Technologies America, Inc.

The FB2200 allows for rapid and precise specimen preparation for both transmission and scanning electron microscopy of semiconductors and other advanced materials. High precision and high milling rates. The use of a new low aberration ion optical system allows a maximum beam current of 60nA at an... [See More]

  • Measurements: Critical dimensions or Trench geometry; Flatness; FilmThickness
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: FIB
Archer Series -- 100
from KLA-Tencor Corporation

The Archer 100 optical overlay control system meets the stringent performance and cost-of-ownership (CoO) requirements for the most advanced design rules and immersion lithography. This fully extendible system satisfies today's tighter overlay budgets yet is designed to keep pace with increasingly... [See More]

  • Measurements: Critical dimensions or Trench geometry
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: Optical / Imaging
XE-3DM
from Park Systems, Inc.

Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]

  • Measurements: Defects, dimples or film residues; Critical dimensions or Trench geometry; Roughness / Waviness
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Technology: Profilometer or AFM
Metrology System -- Z3D-7000 Series
from Zygo Corporation

Simultaneously measures multiple parameters [See More]

  • Measurements: Critical dimensions or Trench geometry; FilmThickness; Roughness / Waviness; Area mapping; DepthProfiling; 3D Surface Metrology
  • Mounting / Loading: In-line; Floor
  • Form Factor: Monitor or instrument
  • Technology: Profilometer or AFM; Optical / Imaging; Interferometer