Defects / ADC Semiconductor Metrology Instruments Datasheets

NWL200 Wafer Loading System
from Nikon Metrology

The NWL200 series is the first lineup of wafer loaders for inspection microscopes capable of loading 100 micron thin wafers. Thanks to a new chuck system, the NWL200 series achieves highly reliable loading suitable for inspection of next-generation semiconductors. Improved wafer-sensing functions... [See More]

  • Measurements: Defects, dimples or film residues
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem; Wafer Loading System
  • Technology: Optical / Imaging
Metrology Solutions for Semiconductors
from Bruker Corporation

Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker ™s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide... [See More]

  • Measurements: Defects, dimples or film residues (optional feature); Roughness / Waviness (optional feature)
  • Applications: Wafer; C-S Thin Film Materials
  • Technology: Profilometer or AFM (optional feature); X-ray Diffractometer (optional feature)
IFG200 Fast Atom Bombardment Ion Gun
from Hiden Analytical

State of the art FAB / ion gun for surface and depth analysis applications [See More]

  • Measurements: Defects, dimples or film residues; Area mapping (optional feature); DepthProfiling
  • Technology: FIB; Spectrometer (SIMS, XRF, FTIR, DLTS, AAS)
  • Form Factor: Ion Beam Gun
  • Applications: Wafer; CVD / PVD
2360
from KLA-Tencor Corporation

Uses a shorter wavelength light source and smaller pixel size to provide the improved imaging inspection sensitivity needed for 90-nm node and below design rules. Selectable UV illumination (Broadband UV, I-Line and G-Line) combines with high numerical aperture to deliver superior resolution and... [See More]

  • Measurements: Defects, dimples or film residues
  • Technology: Optical / Imaging; Ultraviolet Illumination
  • Form Factor: ProbingSystem
  • Applications: Wafer
Automated Optical Inspection System -- nSPEC™
from Nanotronics Imaging

The Nanotronics Imaging nSpec ® is an inspection device designed for high resolution microscopy and detection of wafer defects. With particular application in silicon carbide and Galium Nitride epi wafers, the nSpec ® offers fast quantification and qualification of defects with detailed... [See More]

  • Measurements: Defects, dimples or film residues
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem
  • Technology: Optical / Imaging
Wafer Inspection System -- MX51
from Olympus America Inc.

The Olympus MX51 industrial inspection microscope is optimized for the inspection requirements of a variety of electronic components including semiconductor wafer inspection. Its compact size, ease of operation, 6"x6" stage travel and cost effectiveness make the MX51 an ideal inspection microscope... [See More]

  • Measurements: Defects, dimples or film residues; Particle contamination
  • Mounting / Loading: In-line (optional feature); Manual loading
  • Form Factor: Monitor or instrument
  • Technology: Optical / Imaging
XE-3DM
from Park Systems, Inc.

Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]

  • Measurements: Defects, dimples or film residues; Critical dimensions or Trench geometry; Roughness / Waviness
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Technology: Profilometer or AFM
Desktop Scanning Electron Microscope -- Phenom Pro
from Phenom-World BV

The Phenom Pro desktop SEM is one of the most advanced imaging models in the Phenom series. With its long-life high-brightness CeB6 electron source, the Phenom Pro creates state-of-the-art images with a minimum of user maintenance intervention. The backscattered-electron detector (BSED) and... [See More]

  • Measurements: Composition; Defects, dimples or film residues; Critical dimensions or Trench geometry; Particle contamination; Roughness / Waviness; Area mapping
  • Mounting / Loading: Manual loading
  • Form Factor: Monitor or instrument
  • Technology: FIB
IRIS DIE & Wafer Inspection Systems -- EVA Semiautomatic Align, Stepping & Inspection
from SemiProbe

SemiProbe IRIS inspection systems inspect, locate and identify defects created during wafer manufacturing, probing, bumping, dicing or general handling, providing microelectronic device manufacturers with accurate, timely quality assurance and process information. The IRIS inspection system has... [See More]

  • Measurements: Defects, dimples or film residues; Device, gate or circuit electrical testing; Particle contamination; Area mapping
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem
  • Technology: Optical / Imaging
Laser Diode Chip / Bar Visual Inspector
from TELOPS, Inc.

The laser diode chip/bar visual inspector visually inspects each laser diode chip or bar upper, front and back surface. No-good chips/bars are removed from the tape after inspection. [See More]

  • Measurements: Defects, dimples or film residues; Device, gate or circuit electrical testing; Particle contamination; Crack, Coating Failure, Scratch
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument; ProbingSystem
  • Technology: Optical / Imaging; Wafer sorter or prober
Texture Measurement System -- Microscan
from ULVAC Technologies, Inc.

Provides a broad range of specs suitable for various R & D applications [See More]

  • Measurements: Defects, dimples or film residues; FilmThickness; Roughness / Waviness
  • Technology: Reflectometer; Optical / Imaging
  • Form Factor: Monitor or instrument; Controller
  • Applications: Wafer; CVD / PVD
Laser Machining Microscope -- MIC4
from WDI Wise Device Inc.

This is the only commercially available microscope guaranteeing transmission of more then 80% for all four YAG laser harmonics: 266, 355, 532, and 1064nm - without compromising the review channel fidelity. The MIC4 microscope is instrumental in laser repair of TFT arrays over the wavelength ranging... [See More]

  • Measurements: Defects, dimples or film residues; Thin Film and TFT Array Repairs
  • Mounting / Loading: Floor (optional feature)
  • Form Factor: Monitor or instrument
  • Technology: Optical / Imaging