Semiconductor Metrology Instruments - Spectral Interference Laser Displacement Meter -- SI-F01
from KEYENCE

SI-F Series Spectral Interference Displacement Meter. The SI-F Series Spectral Interference Displacement Meter specializes in super-high accuracy displacement measurement for thickness or position measurement or surface mapping. With resolution down to 1nm, the SI Series is able to see even the... [See More]

  • Measurements: Flatness; FilmThickness
  • Mounting / Loading: In-line; Floor
  • Form Factor: Monitor or instrument; Controller; Sensor or sensing element
  • Technology: Interferometer
Geometry Inspection System for Silicon Ingots
from Micro-Epsilon

The “dimensionCONTROL 8260 for Ingot ” measuring system inspects the surface of the bricks using several laser line scanners and in doing so measures the side lengths, phase lengths, angles, diagonal surfaces and the planarity of the side surfaces completely automatically. The system... [See More]

  • Measurements: Defects, dimples or film residues; Flatness
  • Applications: Wafer
  • Form Factor: Sensor or sensing element
  • Wafer / Part Size: 0 to 2500
Geometry Inspection System for Silicon Ingots
from Micro-Epsilon Group

The “dimensionCONTROL 8260 for Ingot ” measuring system inspects the surface of the bricks using several laser line scanners and in doing so measures the side lengths, phase lengths, angles, diagonal surfaces and the planarity of the side surfaces completely automatically. The system... [See More]

  • Measurements: Defects, dimples or film residues; Flatness
  • Applications: Wafer
  • Form Factor: Sensor or sensing element
  • Wafer / Part Size: 0 to 2500
SigmaTech Wafer Metrology Systems -- UltraMap-300IR
from MicroSense, LLC

Automated Thickness measurement system. IR interferometry probe technology. Single or dual probes. Manual Loading. 0.5um accuracy. 0.1um resolution. Wafer 4" to 12" (100 to 300mm) round or square. Thickness range: 20um to 1mm. Flexible recipe generation. 2D & 3D mapping capability. SECS/GEM... [See More]

  • Measurements: Flatness; WaferThickness
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Technology: Interferometer
Semi-Automated Wafer Measurement System -- Proforma™ 200SA
from MTI Instruments Inc.

The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 75 to 200 mm. wafers, the 200SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around... [See More]

  • Measurements: Flatness; Roughness / Waviness; WaferThickness; Area mapping
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem; Sensor or sensing element
  • Technology: Capacitance or electromagnetic gage
Optistation-3000 Wafer Inspection System
from Nikon Metrology Europe

Its efficient transfer sequence, new robotic arm, FOUP opener, and enhanced macro observation functions all contribute to especially high yield rates – making the OST-3000 a high throughput wafer inspection powerhouse. In addition, the system provides the highest system reliability in its... [See More]

  • Measurements: Defects, dimples or film residues; Flatness; Roughness / Waviness
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: Optical / Imaging
Tropel® FlatMaster® -- FlatMaster® Wafer
from Corning Specialty Materials

Ideal for processes development, particularly for new, non-silicon material [See More]

  • Measurements: Flatness; FilmThickness; WaferThickness; Area mapping
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Technology: Interferometer
Focused Ion Beam System -- FB-2200
from Hitachi High Technologies America, Inc.

The FB2200 allows for rapid and precise specimen preparation for both transmission and scanning electron microscopy of semiconductors and other advanced materials. High precision and high milling rates. The use of a new low aberration ion optical system allows a maximum beam current of 60nA at an... [See More]

  • Measurements: Critical dimensions or Trench geometry; Flatness; FilmThickness
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Technology: FIB
Ultra Gage -- 9500
from KLA-Tencor Corporation

Multi-tool functionality including thickness, shape stress, global and site flatness measurements. Measures 8,700 data points in under 60 seconds. Thin film stress on patterned or monitor wafers. Wide range of options including wafer typing. The 9500 UltraGage is a versatile, multifunctional... [See More]

  • Measurements: Flatness; Microstructure or crystal structure; WaferThickness
  • Mounting / Loading: Manual loading
  • Form Factor: ProbingSystem
  • Technology: Capacitance or electromagnetic gage
NewView 7200 -- 3D Optical Profiling System
from Zygo Corporation

Excellent precision and accuracy [See More]

  • Measurements: Defects, dimples or film residues; Critical dimensions or Trench geometry; Flatness; Roughness / Waviness; Area mapping; DepthProfiling
  • Mounting / Loading: Manual loading
  • Form Factor: Monitor or instrument
  • Technology: Profilometer or AFM; Optical / Imaging; Interferometer