P3 Precision Pattern Profiler
from Nikon Metrology Europe

The Nikon P3 system is designed for automated pattern profile management and line width roughness monitoring of 300mm wafers with fully incorporated macro defect detection, EBR inspection, and automatic defect classification for unsurpassed performance down to the 55nm node. Pattern Profile... [See More]

  • Technology: Profilometer or AFM
  • Measurements: Roughness / Waviness
  • Applications: Wafer; Photolithography
  • Features: Noncontact; Non-destructive
HRP-250
from KLA-Tencor Corporation

The HRP-250 is an automated, advanced surface topography metrology tool, featuring high resolution/high-aspect ratio, stylus-based surface profiling for leading edge 200mm applications. This surface topography metrology tool's ultra-fine 20nm stylus tip option enables down to 45nm-generation surface... [See More]

  • Technology: Profilometer or AFM
  • Mounting / Loading: Floor
  • Form Factor: ProbingSystem
  • Applications: Wafer
XE-3DM
from Park Systems, Inc.

Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series ’ decoupled XY... [See More]

  • Technology: Profilometer or AFM
  • Mounting / Loading: Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer
Metrology System -- Z3D-7000 Series
from Zygo Corporation

Simultaneously measures multiple parameters [See More]

  • Technology: Profilometer or AFM; Optical / Imaging; Interferometer
  • Mounting / Loading: In-line; Floor
  • Form Factor: Monitor or instrument
  • Applications: Wafer; CVD / PVD; Electroplate; Polishing / CMP; Photolithography; Bumping Processes