from Sanyo Denki America, Inc.
CPU cooler for Intel ® PentiumIII (FC-PGA2) / 1.0GHz. [See More]
- Material: Aluminum; Copper
- L: 79
- Device: Active Heat Sink
- W: 67.3
from SFCable.com
CPU Socket 478. CPU Support IntelR 2.53GHz. Solution 1U. Overall Dimension 89.0 x 66.0 x 26.0 mm. Weight 311 g. Material Copper Heatsink. Fan Dimension 60 x 60 x 10 mm. Speed 5300 RPM. Bearing 2 Ball Bearing. Rated Voltage 12 V. Power 3.8 W. Air Flow 24.1 CFM. Noise Level 37.9 dBA. Air Pressure -... [See More]
- Material: Copper
- W: 66
- L: 89
- H: 10
from CompUSA
The Cooler Master Hyper N520 CPU Cooler has a distinct appearance with dual fan brackets along with its unique dual fan cooling design, ensures cool air flows straight through the heatsink. In addition, its copper base guarantees perfect contact between CPU and cooler that optimizes its 5 heat pipes... [See More]
- Material: Aluminum; Copper; Mixed
- W: 62.3
- L: 92
- H: 141
from Dynatron Corp.
CPU Support : LGA 1155: Intel ® Sandy Bridge Xeon ® Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280; LGA1156: Intel ® Core ™ i3 i3-530 & i3-540, Core ™ i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750; Xeon ® Processor 3400 Series; Core... [See More]
- Material: Aluminum; Copper; Mixed
- L: 106
- Device: Active Heat Sink
- W: 106
from Howard Computers
Studies show that the majority of computer failures are the result of heat-related problems. Reduce destructive heat build-up quickly and easily with the Antec fans and cooling systems. Antec provides a better solution to enhance air circulation in the case and to increase hot air exhaustion. [See More]
- Material: Aluminum; Copper; Mixed
from Pixel USA
COOLER MASTER Hyper Z600 RR-600-LBU1-GP CPU Cooler [See More]
- Material: Aluminum; Copper; Mixed
- L: 127
- Device: Passive Heat Sink
- W: 127
