Chemical / Materials Processing Carbides and Carbide Materials (hardmetals)
from Saint-Gobain Performance Ceramics & Refractories
Technical Data. Hexoloy ® SA SiC is a pressureless, sintered form of alpha silicon carbide, with a density greater than 98 percent theoretical. It has a very fine grain structure (4 - 10 microns) for excellent wear resistance and contains no free silicon, which makes it highly chemically... [See More]
- Applications: Wear resistant parts or tooling; Refractory or High Temperature Insulation; Abrasion Resistant; Chemical or material processing; Corrosion resistant
- Shape / Form: Custom Shape; KilnFurniture; Spout; WaferCarrier
- Carbide Type: Silicon Carbide
- Max Use Temperature: 1900
from Saint-Gobain Performance Ceramics & Refractories
Hexoloy ® SE SiC offers an excellent alternative material to metals, superalloys and other ceramics for applications such as chemical processing, high temperature furnaces, and other demanding, severe environment applications. Hexoloy SE SiC provides a full range of exceptional properties in one... [See More]
- Applications: Refractory or High Temperature Insulation; Foundry / Metal Processing; Chemical or material processing
- Shape / Form: Custom Shape
- Carbide Type: Silicon Carbide
- Max Use Temperature: 1900
from Aremco Products, Inc.
Bonds SiC and Graphite Parts, principal use is high vacuum fixtures [See More]
- Applications: Fiberoptics, Radiant Heaters, Temp Probe; Refractory or High Temperature Insulation; Abrasives, ceramics or glass manufacturing; Chemical or material processing; Corrosion resistant; HV / Electrical
- Max Use Temperature: 1371
- Carbide Type: Silicon Carbide
- CTE: 4.32E6
from CoorsTek
Chamber domes (sometimes referred to as lids) are used to create a clean, inert, and protected environment in deposition chambers. Chemical reactions inside the chamber deposit thin layers of metallic, dielectric, or semiconductive material onto the wafers. Chamber lids and liners are exposed to... [See More]
- Applications: Chemical or material processing
- Composition or ASTM/EN Cement Type : Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Carbide Type: Silicon Carbide
- Shape / Form: Custom Shape
from Saint-Gobain Innovative Materials
For many years, Saint-Gobain NorPro has been known for its range of very low surface area macroporous alpha-alumina-based carrier materials. Inert to their environment in most circumstances, the carriers play a vitally active role in many catalytic reactions. Other low-surface area catalyst carrier... [See More]
- Applications: Customer Specified; Chemical or material processing
- Shape / Form: Custom Shape; Ferrule / Eyelet (optional feature); Hollow Stock (Tube, Pipe, Column) (optional feature)
- Carbide Type: Silicon Carbide
- Width / OD: 0.1181 to 19.69
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Applications: Refractory or High Temperature Insulation; Foundry / Metal Processing; Chemical or material processing
- Performance Features: Glaze or protective coating
- Max Use Temperature: 1371
from CoorsTek
Rings cover the wafer edge and perimeter, protecting critical chamber components and extending their useful life. Since they are directly exposed to the deposition process, strong plasma durability and high purity are critical to final wafer yield. SEMICONDUCTOR DEPOSITION PROCESSING. Semiconductor... [See More]
- Applications: Chemical or material processing
- Composition or ASTM/EN Cement Type : Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Carbide Type: Silicon Carbide
- Shape / Form: Custom Shape
from CoorsTek
CoorsTek advanced, high-purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive cleaning cycles. ETCH... [See More]
- Applications: Chemical or material processing
- Composition or ASTM/EN Cement Type : Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Carbide Type: Silicon Carbide
- Shape / Form: Custom Shape
from CoorsTek
Semiconductor deposition processes use a combination of volatile precursor gases, plasma, and high temperature to layer high quality thin films onto wafers. Deposition chambers and wafer handling tools need durable ceramic components to stand up to these challenging environments. CoorsTek provides... [See More]
- Applications: Chemical or material processing
- Composition or ASTM/EN Cement Type : Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Carbide Type: Silicon Carbide
- Shape / Form: Custom Shape
from CoorsTek
Windows are chamber lids designed to transmit RF (radio frequency) and microwave energy into the plasma etch chamber while resisting erosion from the harsh plasma etch environment. An effective window has a low loss tangent (high transmittance) across RF and microwave frequencies. Otherwise, energy... [See More]
- Applications: Chemical or material processing
- Composition or ASTM/EN Cement Type : Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Carbide Type: Silicon Carbide
- Shape / Form: Custom Shape
from CoorsTek
Focus/edge rings are designed to improve etch uniformity around the wafer edge or perimeter. When used with an electrostatic chuck (e-chuck), the wafer rests on the edge focus ring - held in place by the electrostatic charge. ADVANCED CERAMIC COMPONENTS. CoorsTek advanced, high-purity ceramic... [See More]
- Applications: Chemical or material processing
- Composition or ASTM/EN Cement Type : Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
- Carbide Type: Silicon Carbide
- Shape / Form: Custom Shape
from CoorsTek
Lift pins are used in assemblies to lift and move wafers through semiconductor processing positions. Since they are exposed to chamber or other processing conditions, they require robust thermal stability and corrosion resistance. Semiconductor Processing Components. CoorsTek is your partner for... [See More]
- Applications: Wear resistant parts or tooling; Chemical or material processing
- Shape / Form: WaferCarrier
- Carbide Type: Silicon Carbide
from CoorsTek
End effectors, also referred to as semiconductor handling "blades", are the robot's hand to handle and move semiconductor wafers between positions. So end effectors must be dimensionally precise and thermally stable, while having a smooth, abrasion-resistant surface to safely handle wafers without... [See More]
- Applications: Wear resistant parts or tooling; Chemical or material processing
- Shape / Form: WaferCarrier
- Carbide Type: Silicon Carbide