Microelectronic Ceramic Packages -- CuPacks
from Materion Corporation

CuPacks ™ by Materion Microelectronics and Services deliver outstanding performance for cutting edge, high power Si and GaN transistors, and meet the industry ’s demands for low thermal resistance and low RF loss. These unique packages feature 0.2 mm thick copper leads and base, as well... [See More]

  • Material Type: Ni + Au with AuSi or AuSn
  • Shape / Form: BarStock