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Ceramic Thick-Film Substrate -- ADOS-90R
from CoorsTek

Transportation. CoorsTek offers a line of special ceramics that take advantage of higher dielectric properties, such as GPS and microwave applications. These applications are becoming more extensively used in the transportation industry for location and guidance systems. Through CoorsTek, California... [See More]

  • Material: Filled Resin or Composite Material; Alumina
  • Features: Electronics / Semiconductors
  • Form: Fabricated Part or Shaped Stock; WaferSubstrate
Electrical Insulation Tape -- DW 466
from DeWAL Industries, Inc.

DW 466 is a pressure sensitive tape made of closely woven glass fabric and high temperature silicone adhesive. The glass fabric has excellent abrasion resistance and high strength. APPLICATION INFORMATION. This tape is used primarily in electrical applications including splicing and positioning in... [See More]

  • Material: Filled Resin or Composite Material
  • Form: Tape
  • Dielectric Strength: 1.38E8
  • Features: Electronics / Semiconductors; Electrical Power or High Voltage
ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Material: Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy
  • Features: Electronics / Semiconductors; Electrical Power or High Voltage; UL
  • Form: Potting Compound
Thermal -- 920
from Epoxy Technology

A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or... [See More]

  • Material: Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy
  • Form: Potting Compound; Gel, Paste, or Grease
  • Dielectric Constant: 5.19
  • Features: Electronics / Semiconductors
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Material: Filled Resin or Composite Material; Two Component or Catalyst Cured; Epoxy
  • Dielectric Constant: 8.9
  • Dielectric Strength: 4.33E6
  • Form: Adhesives; GapFilling; Gel, Paste, or Grease
Duratron® 2300 Machinable Plastic - Plate Stock
from Quadrant Engineering Plastic Products

Ultem* 2300 is an extruded 30% glass reinforced polyetherimide. It is an amorphous, high-performance polymer with exceptional flame and heat resistance. It performs continuously to 340 °F (171 °C), making it ideal for high strength/high heat applications, and those requiring consistent... [See More]

  • Material: Filled Resin or Composite Material
  • Dielectric Constant: 3.7
  • Dielectric Strength: 3.03E7
  • Resistivity: 1.00E13
Fiberglass -- 2905-10 w/ Kraft Liner
from Saint-Gobain Plastic Films and Tapes

CHR ® Cloth-Glass Tape. CHR ® 2905 is manufactured from heat-resistant fiberglass cloth backing coated with high-temperature silicone adhesive on both sides. 2905 has a wide variety of uses in the industrial and electrical markets. It is most widely used as a high-temperature masking tape... [See More]

  • Material: Filled Resin or Composite Material
  • Form: Tape
  • Dielectric Strength: 314961
  • Features: Electrical Power or High Voltage
MACOR® Glass-Ceramic Bars -- 12" Length MACOR Bar
from San Jose Delta Associates, Inc.

Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn ’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000 °C, has low thermal conductivity and is a good electrical insulator. [See More]

  • Material: Filled Resin or Composite Material
  • Dielectric Constant: 5.67 to 6.03
  • Dielectric Strength: 6.24E7
  • Resistivity: 1.00E17
NanoStock Low Loss Polymer Ceramic Composite, Rigid Composite Dielectric Sheet
from TPL, Inc.

TPL, Inc. is a materials science-based technology development and manufacturing company, a technologies to products leader based in Albuquerque, New Mexico. TPL has three divisions the Defense Systems Division, the Capacitance Products Division and Micropower Technologies Division. The Defense... [See More]

  • Material: Filled Resin or Composite Material
  • Features: Electronics / Semiconductors; Electrical Power or High Voltage
  • Dielectric Constant: 4.75 to 5.03
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Material: Filled Resin or Composite Material; Thermoset or RTV; Epoxy
  • Dielectric Constant: 4.2
  • Dielectric Strength: 1.81E7
  • Form: Potting Compound; GapFilling; Gel, Paste, or Grease
Adjustable Flexibility Epoxy -- 10-3055
from Epoxies Etc...

10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible. [See More]

  • Material: Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy
  • Dielectric Constant: 3.3 to 3.6
  • Dielectric Strength: 1.57E7
  • Form: Adhesives
Piezoceramic Bending Elements -- EC-65 Type II Material
from EXELIS - Acoustic Sensors

Adhesively bonded piezoelectric element for motor and actuator applications [See More]

  • Material: Filled Resin or Composite Material
  • Form: Fabricated Part or Shaped Stock (optional feature); BarStock (optional feature)
  • Dielectric Constant: 1725
  • Features: Metallized or electrode film (optional feature)
Fiberglass Cloth Tape -- 160-5S
from Green Belting Industries LTD

From tightly woven high tensile glass cloth [See More]

  • Material: Filled Resin or Composite Material
  • Form: Tape
  • Dielectric Strength: 500
Hysol® Die Attach Adhesive -- QMI 282HT
from Henkel Corporation - Electronics

Withstands polymer decomposition during reflow [See More]

  • Material: Filled Resin or Composite Material; Thermoset or RTV; Silicone
  • Features: Electronics / Semiconductors
  • Form: Adhesives
Magnalube-G 5 Lb. Can -- MG5LB
from Magnalube, Inc.

Magnalube-G PTFE grease will ultimately reduce the costs associated with maintenance, part replacement, and new machinery by reducing wear and protecting sensitive parts in a wide range of demanding applications. Magnalube-G PTFE Grease deposits a fine, protective and lubricating film on metal... [See More]

  • Material: Filled Resin or Composite Material; Fluoropolymer
  • Form: Gel, Paste, or Grease
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Material: Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Polyurethane
  • Form: Coating; Encapsulant; Potting Compound
  • Dielectric Constant: 6.85 to 7.6
  • Features: Electronics / Semiconductors; Electrical Power or High Voltage; UL
Glass Cloth TAC-TAPE™ -- 6603-07
from Taconic

Superior cut-through and excellent flexibility make our glass cloth tapes ideal for masking parts for plasma spraying and for inner and outer wraps on transformers and motors. [See More]

  • Material: Filled Resin or Composite Material; Acrylic or Polyacrylate
  • Form: Tape
  • Dielectric Strength: 1.69E7
  • Features: Cut-Through and Abrasion Resistance
Eccofloat® DS-32
from Trelleborg Offshore

Eccofloat DS-32 is an ultra high performance syntactic foam comprised of tiny hydro-space quality hollow glass microspheres in a resin matrix. The material is homogeneous in that pieces cut from a block will have the same properties as the original block. [See More]

  • Material: Filled Resin or Composite Material; Epoxy
  • Form: BarStock