Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Form: Adhesives; GapFilling; Gel, Paste, or Grease
  • Material: Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy
  • Dielectric Strength: 2.20E7
  • Features: Electronics / Semiconductors
Dymax UV Curing Adhesive -- 921-GEL 10ML MR SYRINGE
from Ellsworth Adhesives

Dymax 921 Series adhesives are high tensile strength, UV-curable resins that are especially well suited when rigid adhesive bonds are desired. Sold as a pack (10/pk). [See More]

  • Form: Adhesives; GapFilling
  • Material: UV or Radiation Cured; Acrylic or Polyacrylate
  • Dielectric Strength: 6.30E7
  • Features: Electronics / Semiconductors
Thermal -- TJ1104-LH
from Epoxy Technology

A black, single component, low halogen, electrically insulating die attach adhesive with extended pot life. [See More]

  • Form: Adhesives; GapFilling; Gel, Paste, or Grease
  • Material: Filled Resin or Composite Material; Thermoset or RTV; Epoxy
  • Dielectric Constant: 3.68
  • Features: Electronics / Semiconductors
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Form: Adhesives; GapFilling; Gel, Paste, or Grease
  • Dielectric Constant: 8.9
  • Dielectric Strength: 4.33E6
  • Material: Filled Resin or Composite Material; Two Component or Catalyst Cured; Epoxy
SolarBond™ Frame Sealant
from Saint-Gobain Plastic Films and Tapes

SolarBond Frame Sealant. SolarBondTM Frame Sealant is a new generation frame sealant that brings increased performance while reducing the overall production costs for PV module manufacturers. [See More]

  • Form: GapFilling
  • Material: Thermoset or RTV
  • Dielectric Strength: 1.57E6
Scotch® Insulating Spray 1601
from 3M Fire Protection

Fast-drying, protects surfaces against weather, moisture, corrosion, oil [See More]

  • Form: GapFilling
  • Features: Electronics / Semiconductors
  • Dielectric Strength: 3.35E7
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Form: Potting Compound; GapFilling; Gel, Paste, or Grease
  • Dielectric Constant: 4.2
  • Dielectric Strength: 1.81E7
  • Material: Filled Resin or Composite Material; Thermoset or RTV; Epoxy
Epoxy Adhesive -- 10-3022
from Epoxies Etc...

10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester mesh to aluminum frames and... [See More]

  • Form: GapFilling
  • Dielectric Constant: 3.8
  • Dielectric Strength: 1.77E7
  • Material: Thermoset or RTV; Two Component or Catalyst Cured; Epoxy
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Form: Coating; Encapsulant; Potting Compound; GapFilling
  • Dielectric Constant: 2.78
  • Dielectric Strength: 1.52E7
  • Material: Two Component or Catalyst Cured; Silicone
Thermal Management Adhesive -- 5404
from Henkel Corporation - Electronics

Ease-of-use, thermal conductivity [See More]

  • Form: Coating; Adhesives; Encapsulant; Potting Compound; GapFilling; Gel, Paste, or Grease
  • Dielectric Constant: 5.4 to 5.75
  • Dielectric Strength: 4.34E8
  • Material: Filled Resin or Composite Material; Thermoset or RTV; Silicone
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Form: GapFilling
  • Features: Electronics / Semiconductors; Electrical Power or High Voltage
  • Material: Thermoset or RTV; Epoxy
Silicone Compound -- RTV 400-900
from Novagard Solutions

Non-corrosive, single component silicone compound, non-flowable [See More]

  • Form: GapFilling; Gel, Paste, or Grease
  • Features: Electronics / Semiconductors; Electrical Power or High Voltage; UL
  • Material: Elastomer or Rubber; Thermoset or RTV; Silicone
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Form: Coating; Encapsulant; Potting Compound; GapFilling
  • Material: Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy
  • Dielectric Constant: 4.32 to 4.4
  • Features: Electronics / Semiconductors; Electrical Power or High Voltage