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Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Form: Adhesives; GapFilling; Gel, Paste, or Grease
  • Material: Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy
  • Dielectric Strength: 2.20E7
  • Features: Electronics / Semiconductors
Dymax UV Curing Adhesive -- 921-GEL 10ML MR SYRINGE
from Ellsworth Adhesives

Dymax 921 Series adhesives are high tensile strength, UV-curable resins that are especially well suited when rigid adhesive bonds are desired. Sold as a pack (10/pk). [See More]

  • Form: Adhesives; GapFilling
  • Material: UV or Radiation Cured; Acrylic or Polyacrylate
  • Dielectric Strength: 6.30E7
  • Features: Electronics / Semiconductors
Similar parts from Ellsworth Adhesives
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Form: Adhesives; GapFilling; Gel, Paste, or Grease
  • Dielectric Constant: 8.9
  • Dielectric Strength: 4.33E6
  • Material: Filled Resin or Composite Material; Two Component or Catalyst Cured; Epoxy
SolarBond™ Frame Sealant
from Saint-Gobain Plastic Films and Tapes

SolarBond Frame Sealant. SolarBondTM Frame Sealant is a new generation frame sealant that brings increased performance while reducing the overall production costs for PV module manufacturers. [See More]

  • Form: GapFilling
  • Material: Thermoset or RTV
  • Dielectric Strength: 1.57E6
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Form: Adhesives; Potting Compound; GapFilling; Powder
  • Dielectric Constant: 5 to 7
  • Dielectric Strength: 2 to 38
  • Material: Ceramic or Cement; Two Component or Catalyst Cured
Scotch® Insulating Spray 1601
from 3M Fire Protection

Fast-drying, protects surfaces against weather, moisture, corrosion, oil [See More]

  • Form: GapFilling
  • Features: Electronics / Semiconductors
  • Dielectric Strength: 3.35E7
Similar parts from 3M Fire Protection
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Form: Coating; Encapsulant; Potting Compound; GapFilling
  • Dielectric Constant: 2.78
  • Dielectric Strength: 1.52E7
  • Material: Two Component or Catalyst Cured; Silicone
Thermal Management Adhesive -- 5404
from Henkel Corporation - Electronics

Ease-of-use, thermal conductivity [See More]

  • Form: Coating; Adhesives; Encapsulant; Potting Compound; GapFilling; Gel, Paste, or Grease
  • Dielectric Constant: 5.4 to 5.75
  • Dielectric Strength: 4.34E8
  • Material: Filled Resin or Composite Material; Thermoset or RTV; Silicone
Similar parts from Henkel Corporation - Electronics
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Form: Coating; Encapsulant; Potting Compound; GapFilling
  • Material: Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy
  • Dielectric Constant: 4.32 to 4.4
  • Features: Electronics / Semiconductors; Electrical Power or High Voltage