Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Features: High Dielectric; UL Rating; Unfilled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
Scotch-Weld Adhesive 1386 -- 1386 [1386 from 3M]
from R. S. Hughes Company, Inc.

Very clear, fast setting, room temperature curing, two-part adhesive [See More]

  • Features: UL Rating; Unfilled
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
Circuit Board Protection -- ES6010
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Features: Encapsulant, Potting Compound; Flame Retardant; UL Rating; Filled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset
  • Industry: Electronics