UL Approved Epoxy Adhesives Datasheets

Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Features: High Dielectric; UL Rating; Unfilled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
Scotch-Weld Adhesives DP105 -- DP105 [DP105 from 3M]
from Heilind Electronics, Inc.

Very clear, fast setting, room temperature curing, two-part adhesive [See More]

  • Features: UL Rating; Unfilled
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
HYSOL ES1000
from Henkel Corporation - Industrial

HYSOL ® ES1000 ™ is a two-component, long pot life casting system with excellent handling properties. This material has good thermal shock resistance and low exotherm, making it suitable for encapsulation of various components and modules. [See More]

  • Features: UL Rating
  • Viscosity: 25000
  • Cure / Technology: Two Component  
  • Use Temperature: -13 to 221
Two Component Room Temperature Curing Epoxy -- EP21FRNS-2
from Master Bond, Inc.

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60°F to 200°F. It is... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Leveling Filling; Non-corrosive; Thermal Insulation; UL Rating; Filled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates