from ELANTAS PDG, Inc.
Trickle resin system for impregnation or protective overcoat [See More]
- Industry: Aerospace; Automotive; Electric Power; Marine; OEM or Industrial
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
from Ellsworth Adhesives
Sold as a case (4 Kits/case). OXY-CAST 6850 FTLV with HARDENER XL is a low viscosity, versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. Gallon kit. [See More]
- Industry: Electronics; Electric Power
- Type / Form: Liquid
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from ITW Polymer Technologies - Insulcast Division
INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Construction; OEM or Industrial; Electronic Encapsulants
- Type / Form: Gel
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Plastic
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Cure / Technology: Two Component
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Metal
- Cure / Technology: Thermoset; Single Component
- Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
