AIRSTONE™ Adhesive System
from Dow Polyurethanes

The AIRSTONE ™ Adhesive System consists of an epoxy resin and two epoxy hardeners with different pot lives. This solvent free, highly thixotropic adhesive has been optimized to meet the stringent requirements of composite wind turbine manufacturing. Applications. This AIRSTONE Adhesive System... [See More]

  • Industry: Electric Power
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Features: Laminaes
Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Industry: Aerospace; Automotive; Electric Power; Marine; OEM or Industrial
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
FTLV with HARDENER Casting System Kit -- 90-004074
from Ellsworth Adhesives

Sold as a case (4 Kits/case). OXY-CAST 6850 FTLV with HARDENER XL is a low viscosity, versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. Gallon kit. [See More]

  • Industry: Electronics; Electric Power
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
INSULCAST 116 FR Room Temperature Cure, Equal Ratio Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Plastic
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Cure / Technology: Two Component  
  • Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
Double/Bubble® Epoxy Adhesive -- 4008 [4008 from Royal Adhesives and Sealants LLC]
from All-Spec Industries

x [See More]

  • Industry: Electric Power; OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood; Leather
  • Cure / Technology: Two Component  
20 Minute Set Epoxy -- 10-3020
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Jewelry
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial; Tooling; Speakers
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Substrate Compatibility: Metal
  • Cure / Technology: Thermoset; Single Component
  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled