3M™ Scotch-Weld™ Epoxy Adhesive 1386 Cream, 1 Quart, 12 per case -- EC1386
from 3M Industrial Adhesives and Tapes

3M ™ Scotch-Weld ™ Epoxy Adhesive 1386 is a one-part heat curing high viscosity epoxy adhesive. High temperature strength. Impact resistant. High peel strength. General industrial, sporting goods, solar energy, wind energy, composites, electronics, military, metal bonding, transportation... [See More]

  • Industry: Electronics; Military; OEM or Industrial
  • Viscosity: 75000 to 175000
  • Substrate Compatibility: Ceramic, Glass; Metal
2 Ton®Clear Epoxy -- 14310 [14310 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Industry: Electronics
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood
Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Aerospace; Electronics; Military; OEM or Industrial
  • Substrate Compatibility: Dissimilar Substrates
  • Cure / Technology: Thermoset; Two Component  
  • Features: High Dielectric; Laminaes; Non-corrosive; Sealant; Filled
Emerson & Cuming ECCOBOND 55 Epoxy Adhesive Black 1 qt Can -- 55 WHT 2LB RESIN ONLY
from Ellsworth Adhesives

ECCOBOND 55 is an unfilled, low viscosity, general purpose epoxy adhesive resin; it has good wetting to most substrates, good chemical, solvent and water resistance. Cures with Catalyst 9 , or Catalyst 23LV , not included. 2 lb Quart. [See More]

  • Industry: Electronics; OEM or Industrial
  • Use Temperature: -40 to 311
  • Features: Unfilled
  • Dielectric Strength: 432
Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Cure / Technology: Two Component  
  • Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
3M™ Scotch-Weld™ Adhesive -- DP-460 EG
from 3M Electronics Design & Manufacturing

Two-part room-temperature-curing epoxy with high durability, 4500 psi OLS, and 50 PIW on aluminum. Reaches handling strength in 4-6 hours. Lower ionic and outgassing impurities than typical epoxies. 2:1 ratio. [See More]

  • Industry: Electronics
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Metal
Double/Bubble® Epoxy Adhesive -- 4001 [4001 from Royal Adhesives and Sealants LLC]
from All-Spec Industries

"//www.youtube.com/watch?v=wvxiOBwXWF4"" > Hardman Double/Bubble Epoxy Demonstration" [See More]

  • Industry: Automotive; Electronics
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood; Leather
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Industry: Electronics; OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: Thermoset
  • Features: Electrically Conductive; Thermally Conductive; Filled
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Industry: Electronics; OEM or Industrial
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Jewelry
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
Chipbonder® Surface Mount Adhesive -- 3607
from Henkel Corporation - Electronics

Designed for high speed printing and dispensing [See More]

  • Industry: Electronics
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component
  • Features: Thermal Insulation; Filled
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial; Tooling; Speakers
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
Epoxy Adhesive -- E109
from Koford Engineering, LLC

E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic... [See More]

  • Industry: Electronics
  • Substrate Compatibility: Electronics
  • Cure / Technology: Thermoset; Single Component
  • Use Temperature: 257 to 392
Engineered Materials -- Silvertech PT 1 Epoxy
from Materion Corporation

Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]

  • Industry: Electronics
  • Features: Electrically Conductive
  • Cure / Technology: Two Component  
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Substrate Compatibility: Metal
  • Cure / Technology: Thermoset; Single Component
  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled