from 3M Industrial Adhesives & Tapes Canada
3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy adhesive. 4:5 mix ratio, 60 minute work life and handling strength in approximately 8 hours. This kit contains 1.6 fl. oz. of part B and 2 fl. oz. of part A. 60 minute worklife. High viscosity. Rigid bonds. General... [See More]
- Industry: Electronics; Military; Construction; OEM or Industrial
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Wood
- Cure / Technology: Two Component
- Viscosity: 400000
- 3M™ Scotch-Weld™ Epoxy Adhesive 1838L Translucent, Part B/A, 2 fl oz Tube Kit, 6 per case -- 62352005359,
- 3M™ Scotch-Weld™ Epoxy Adhesive 2214 Hi-Density Gray, 6 fl oz Plastic Cartridge, 6 per case -- 62341429306,
- 3M™ Scotch-Weld™ Epoxy Adhesive 2214 Hi-Temp Gray, 6 fl oz, 6 per case -- 62340229301,
from Applied Industrial Technologies
- Industry: Electronics
- Type / Form: Liquid
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Industry: Aerospace; Electronics; Military; OEM or Industrial
- Substrate Compatibility: Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; Laminaes; Non-corrosive; Sealant; Filled
from Ellsworth Adhesives
ECCOBOND 55 is an unfilled, low viscosity, general purpose epoxy adhesive resin; it has good wetting to most substrates, good chemical, solvent and water resistance. Cures with Catalyst 9 , or Catalyst 23LV , not included. 2 lb Quart. [See More]
- Industry: Electronics; OEM or Industrial
- Use Temperature: -40 to 311
- Features: Unfilled
- Dielectric Strength: 432
from Epoxy Technology
EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]
- Industry: Electronics
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Metal; Plastic
from ITW Polymer Technologies - Insulcast Division
INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]
- Industry: Electronics; OEM or Industrial
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Features: Flexible
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Cure / Technology: Two Component
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
from R. S. Hughes Company, Inc.
3M EPX DP-460 EG OFFWHT; 37ML DUO-PAK EPXY. [See More]
- Industry: Electronics
from 3M Electronics Markets Materials Division
Two-part room-temperature-curing epoxy with high durability, 4500 psi OLS, and 50 PIW on aluminum. Reaches handling strength in 4-6 hours. Lower ionic and outgassing impurities than typical epoxies. 2:1 ratio. [See More]
- Industry: Electronics
- Type / Form: Liquid
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Metal
from Electro-Lite Corporation
ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]
- Industry: Electronics; OEM or Industrial
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
from Henkel Corporation - Electronics
Designed for high speed printing and dispensing [See More]
- Industry: Electronics
- Type / Form: Gel
- Cure / Technology: Thermoset; Single Component
- Features: Thermal Insulation; Filled
from Koford Engineering, LLC
E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic... [See More]
- Industry: Electronics
- Substrate Compatibility: Electronics
- Cure / Technology: Thermoset; Single Component
- Use Temperature: 257 to 392
from Materion Corporation
Silvertech PT-1 ™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be... [See More]
- Industry: Electronics
- Features: Electrically Conductive
- Cure / Technology: Two Component
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Metal
- Cure / Technology: Thermoset; Single Component
- Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
