from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Features: High Dielectric; Laminaes; Non-corrosive; Sealant; Filled
- Substrate Compatibility: Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Electronics; Military; OEM or Industrial
from Ellsworth Adhesives
OXY-BOND 109-DP is a transparent, two-part, low viscosity epoxy resin formulation recommended for industrial adhesive, small potting and laminating applications where sparkling clarity and excellent structural, mechanical and electrical properties are required. 50ML MixPac. [See More]
- Features: High Dielectric; Laminaes
- Type / Form: Liquid
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Optical Fibers
from Hapco, Inc.
An economical, general purpose, epoxy laminating and binder system. A clear amber, general purpose system that can be used with a variety of fillers for virtually all room temperature casting and laminating applications. As a laminating system, the extremely low viscosity of HAPREZ ™ 3742... [See More]
- Features: Encapsulant, Potting Compound; Laminaes
- Type / Form: Liquid
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Tooling
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Cure / Technology: Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
