AIRSTONE™ Adhesive System
from Dow Polyurethanes

The AIRSTONE ™ Adhesive System consists of an epoxy resin and two epoxy hardeners with different pot lives. This solvent free, highly thixotropic adhesive has been optimized to meet the stringent requirements of composite wind turbine manufacturing. Applications. This AIRSTONE Adhesive System... [See More]

  • Features: Laminaes
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Electric Power
Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Sealant; Filled
  • Substrate Compatibility: Dissimilar Substrates
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; Electronics; Military; OEM or Industrial
Two-Component Epoxy 50ML -- 90-001896
from Ellsworth Adhesives

OXY-BOND 109-DP is a transparent, two-part, low viscosity epoxy resin formulation recommended for industrial adhesive, small potting and laminating applications where sparkling clarity and excellent structural, mechanical and electrical properties are required. 50ML MixPac. [See More]

  • Features: High Dielectric; Laminaes
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Optical Fibers
Haprez™ 3742 General Purpose Epoxy Laminating Binder System -- 3742
from Hapco, Inc.

An economical, general purpose, epoxy laminating and binder system. A clear amber, general purpose system that can be used with a variety of fillers for virtually all room temperature casting and laminating applications. As a laminating system, the extremely low viscosity of HAPREZ ™ 3742... [See More]

  • Features: Encapsulant, Potting Compound; Laminaes
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Tooling
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Cure / Technology: Two Component  
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
3M™ Scotch-Weld™ Structural Adhesive Film -- AF-3185
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Structural Adhesive AF 3185 film is a non-volatile, thermosetting epoxy laminating adhesive and glass cloth combination designed for the structural bonding and for the preparation of reinforced epoxy glass laminate. [See More]

  • Features: Laminaes
  • Industry: Aerospace; OEM or Industrial
  • Cure / Technology: Thermoset; Single Component
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates