3M™ Scotch-Weld™ Epoxy Adhesive 1386 Cream, 1 Quart, 12 per case -- EC1386
from 3M Industrial Adhesives and Tapes

3M ™ Scotch-Weld ™ Epoxy Adhesive 1386 is a one-part heat curing high viscosity epoxy adhesive. High temperature strength. Impact resistant. High peel strength. General industrial, sporting goods, solar energy, wind energy, composites, electronics, military, metal bonding, transportation... [See More]

  • Industry: Electronics; Military; OEM or Industrial
  • Viscosity: 75000 to 175000
  • Substrate Compatibility: Ceramic, Glass; Metal
5-Minute® Epoxy -- 14250 [14250 from ITW Devcon]
from Applied Industrial Technologies

25 ml dev-tube ™, a rapid-curing, general purpose adhesive/encapsulant [See More]

  • Industry: Construction; OEM or Industrial
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Wood
POLY-CARB MARK-120
from Dow Polyurethanes

LOW MODULUS HIGH STRENGTH PATCHING SYSTEM FOR CONCRETE A two-component, low modulus, high strength epoxy system and a special blend of properly graded dry silica aggregate. The MARK-120 Patching System provides a chemically inert, highly abrasion resistant surface when applied on a properly prepared... [See More]

  • Industry: Marine; Sanitary; Construction; OEM or Industrial; Bidge Deck Protection, Road Construction, Parking Deck and Ramps
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Concrete, Masonry
Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Industry: Aerospace; Automotive; Electric Power; Marine; OEM or Industrial
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
3M Automix 5885 EZ Sand 200 ml cartridge -- 5885 AUTOMIX EZ SAND 200ML
from Ellsworth Adhesives

3M Automix EZ Sand Rigid Parts Repair 5885 is a two-part epoxy that is used to repair SMC, FRP (traditional fiberglass), and other rigid plastic parts. 200ml Duo-Pak. Sold by pack (6/pack). [See More]

  • Industry: OEM or Industrial
  • Cure / Technology: Two Component  
UV -- OG154-1
from Epoxy Technology

Single component, UV curable epoxy for adhesive sealing and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical and scientific/OEM industries. Replacement for EPO-TEK OG154. [See More]

  • Industry: Optical; Photonics; OEM or Industrial; Semiconductors, IC's
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Substrate Compatibility: Ceramic, Glass
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Cure / Technology: Two Component  
  • Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
Scotch-Weld Adhesive 1386 -- 1386 [1386 from 3M]
from R. S. Hughes Company, Inc.

Very clear, fast setting, room temperature curing, two-part adhesive [See More]

  • Industry: Construction; OEM or Industrial
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
3M™ Scotch-Weld™ Adhesive And Sealant Kit -- 3537
from 3M Aerospace and Aircraft Maintenance Division

Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]

  • Industry: Aerospace; OEM or Industrial
  • Features: Sealant; Flexible
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
1 Minute™ Fast Curing Epoxy Gel -- 14277 [14277 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Industry: Construction; OEM or Industrial
  • Type / Form: Gel
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Industry: Electronics; OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: Thermoset
  • Features: Electrically Conductive; Thermally Conductive; Filled
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Industry: Electronics; OEM or Industrial
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Jewelry
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Industry: OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: Encapsulant, Potting Compound; Unfilled
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial; Tooling; Speakers
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
Epoxy-Lock®
from ND Industries, Inc.

Meets IFI 125 & 525 standards, exceptional locking power [See More]

  • Industry: Aerospace; Automotive; Marine; Construction; OEM or Industrial
  • Type / Form: Liquid
  • Cure / Technology: Single Component
  • Substrate Compatibility: Metal
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Substrate Compatibility: Metal
  • Cure / Technology: Thermoset; Single Component
  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled