Industry:Other Epoxy Adhesives Datasheets

POLY-CARB MARK-10
from Dow Polyurethanes

A solvent-less, low viscosity, high modulus, two-part epoxy adhesive designed for high strength permanent repair of structural cracks in concrete. Continuous metering and mixing equipment is recommended for the application of the MARK-10 System. Features. Low viscosity provides deeper penetration... [See More]

  • Industry: Construction; Infrastructure Seals and Skid-resistant & Waterproof Coatings, Road Construction
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Concrete, Masonry
General Purpose Adhesive GL Kit -- 90-004519
from Ellsworth Adhesives

OXYBOND 107 is general purpose structural adhesive designed for applications where outstanding shock and peel resistance are required. 2 gallon kit. [See More]

  • Industry: General Purpose
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Electrical -- H20E-SLR
from Epoxy Technology

A two component, electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels. [See More]

  • Industry: Solar
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Two Component  
  • Features: Electrically Conductive; Thermally Conductive; Filled
Custom Epoxy Resin
from Gabriel Performance Products, LLC

Specialty Chemicals. Specialized Focus. Specialty chemicals are what we do and who we are, which has made us a leader in performing complex organic synthesis to provide the highest quality products to meet your exacting custom manufacturing requirements. Need to scale up from lab to pilot to larger... [See More]

  • Industry: Aerospace; Automotive; Sanitary; Petrochemical, Personal Care, Chemical
  • Cure / Technology: Thermoset
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Construction; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
6 Minute® Epoxy Gel -- 14255 [14255 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Industry: OEM or Industrial; Display, Applicance,Furniture Makers
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Metal
Aremco-Bond™ Epoxy -- 526N
from Aremco Products, Inc.

Clear-amber, system for tough bonding applications [See More]

  • Industry: Electronics; OEM or Industrial; Motor Assembly
  • Type / Form: Liquid
  • Cure / Technology: Thermoset
  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Unfilled
Rezklad Machine Adhesive
from Atlas Minerals and Chemicals, Inc.

Bond coat to adhere equipment bases and metal plates to concrete or masonry substrates [See More]

  • Industry: Automotive; Machinery Adhesive
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Concrete, Masonry; Metal
20 Minute Set Epoxy -- 10-3020
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Jewelry
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
EPO-TEK Epoxy -- 353ND
from Fiber Instrument Sales, Inc./FIS

Epoxy remains liquid until heat is applied [See More]

  • Industry: Fiber Optic Connections
  • Type / Form: Liquid
  • Cure / Technology: Thermoset
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial; Tooling; Speakers
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Cure / Technology: Thermoset; Two Component  
  • Features: Flexible; Unfilled
Non-Conductive Insulating Epoxy Resin -- ANE-10932
from Protavic America, Inc.

Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Screen Printing
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component
  • Substrate Compatibility: Ceramic, Glass