POLY-CARB MARK-10
from Dow Polyurethanes

A solvent-less, low viscosity, high modulus, two-part epoxy adhesive designed for high strength permanent repair of structural cracks in concrete. Continuous metering and mixing equipment is recommended for the application of the MARK-10 System. Features. Low viscosity provides deeper penetration... [See More]

  • Industry: Construction
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Concrete, Masonry
General Purpose Adhesive GL Kit -- 90-004519
from Ellsworth Adhesives

OXYBOND 107 is general purpose structural adhesive designed for applications where outstanding shock and peel resistance are required. 2 gallon kit. [See More]

  • Industry: General Purpose
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Electrical -- H20E-SLR
from Epoxy Technology

A two component, electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels. [See More]

  • Industry: Solar
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Two Component  
  • Features: Electrically Conductive; Thermally Conductive; Filled
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Cure / Technology: Thermoset; Two Component  
  • Features: Flexible; Unfilled
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Cure / Technology: Two Component  
  • Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
6 Minute® Epoxy Gel -- 14255 [14255 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Industry: OEM or Industrial; Display, Applicance,Furniture Makers
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Metal
Aremco-Bond™ Epoxy -- 526N
from Aremco Products, Inc.

Clear-amber, system for tough bonding applications [See More]

  • Industry: Electronics; OEM or Industrial; Motor Assembly
  • Type / Form: Liquid
  • Cure / Technology: Thermoset
  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Unfilled
Rezklad Machine Adhesive
from Atlas Minerals and Chemicals, Inc.

Bond coat to adhere equipment bases and metal plates to concrete or masonry substrates [See More]

  • Industry: Automotive; Machinery Adhesive
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Concrete, Masonry; Metal
20 Minute Set Epoxy -- 10-3020
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Jewelry
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
EPO-TEK Epoxy -- 353ND
from Fiber Instrument Sales, Inc./FIS

Epoxy remains liquid until heat is applied [See More]

  • Industry: Fiber Optic Connections
  • Type / Form: Liquid
  • Cure / Technology: Thermoset
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial; Tooling; Speakers
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
Non-Conductive Insulating Epoxy Resin -- ANE-10932
from Protavic America, Inc.

Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Screen Printing
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component
  • Substrate Compatibility: Ceramic, Glass