Industry:Other Epoxy Adhesives Datasheets

Adhesives Two Component Systems -- VORAMER MB+ME
from Dow Polyurethanes

VORAMER* Industrial Adhesives and Binders can be used as binder in a variety of recycling applications, bonding together different kinds of shredded materials such as rubber, flexible polyurethane foams, EVA, cork and gravel. VORAMER binders are based on Dow's prepolymer technology and expertise. [See More]

  • Industry: Outdoor Recreation Applications
Electrically Conductive Epoxy -- EPO-TEK® H20E-SLR
from Epoxy Technology

A two component, electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels. [See More]

  • Industry: Solar
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Two Component  
  • Features: Electrically Conductive; Thermally Conductive; Filled
Loctite E-05MR Hysol Epoxy Structural Adhesive
from Henkel Corporation - Industrial

Loctite ® E-05MR ™ Hysol ® Epoxy Adhesive is a clear, two-component, fast room temperature curing epoxy multi-surface structural adhesive, which provides excellent moisture resistance and exceptional toughness for a 5-minute epoxy. Its low odor and non-skinning properties make bulk... [See More]

  • Industry: Food
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Two Component  
  • Viscosity: 25000
Aremco-Bond™ Epoxy -- 526N
from Aremco Products, Inc.

Clear-amber, system for tough bonding applications [See More]

  • Industry: Electronics; OEM or Industrial; Motor Assembly
  • Type / Form: Liquid
  • Cure / Technology: Thermoset
  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Unfilled
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Jewelry
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
EPO-TEK Epoxy -- 353ND
from Fiber Instrument Sales, Inc./FIS

Epoxy remains liquid until heat is applied [See More]

  • Industry: Fiber Optic Connections
  • Type / Form: Liquid
  • Cure / Technology: Thermoset
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial; Tooling; Speakers
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Cure / Technology: Thermoset; Two Component  
  • Features: Flexible; Unfilled
Non-Conductive Insulating Epoxy Resin -- ANE-10932
from Protavic America, Inc.

Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Screen Printing
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component
  • Substrate Compatibility: Ceramic, Glass