Semiconductors / IC Packaging Epoxy Adhesives Datasheets

Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Construction; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Aremco-Bond™ -- 860
from Aremco Products, Inc.

Exceptional mechanical and thermal properties [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: Thermoset
  • Features: Electrically Conductive; Thermally Conductive; Filled
604057 [CW2400 from Circuit Works]
from Farnell Europe

ADHESIVE, SILVER EPOXY, CONDUCTIVE [See More]

  • Industry: Semiconductors, IC's
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Substrate Compatibility: Metal
  • Cure / Technology: Thermoset; Single Component
  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled