Electrially Insulative Epoxy -- OD1001
from Epoxy Technology

A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device... [See More]

  • Industry: Electronics; Optical; Photonics; Semiconductors, IC's
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermal Insulation
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Cure / Technology: Two Component  
  • Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
Aremco-Bond™ -- 860
from Aremco Products, Inc.

Exceptional mechanical and thermal properties [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: Thermoset
  • Features: Electrically Conductive; Thermally Conductive; Filled
604057 [CW2400 from Circuit Works]
from Farnell Europe

ADHESIVE, SILVER EPOXY, CONDUCTIVE [See More]

  • Industry: Semiconductors, IC's
Hysol® Semiconductor Encapsulant -- 3515
from Henkel Corporation - Electronics

Meets JEDEC level testing requirements, compatible with lead free testing [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Filled
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Substrate Compatibility: Metal
  • Cure / Technology: Thermoset; Single Component
  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled