2 Ton®Clear Epoxy -- 14310 [14310 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Features: Unfilled
3M Scotch-Weld DP110 Epoxy Adhesive Clear 1.7 oz Duo-Pak -- DP110 CLEAR 1.7 OZ DUO-PAK
from Ellsworth Adhesives

3M Scotch-Weld DP110 Clear is a two-part epoxy adhesive which combines a fast cure with flexibility. 1.7 ounce Duo-pak. Available Applicator and Static Mix Nozzle [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Industry: OEM or Industrial
  • Cure / Technology: Two Component  
  • Elongation: 40.0
Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Features: Electrically Conductive; EMI/RFI Shielding; Filled
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Features: Flexible; Unfilled
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
  • Cure / Technology: Two Component  
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
Thermally Conductive Epoxy -- OB-100 / OB-200 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Wood
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Features: High Dielectric; Thermally Conductive
Scotch-Weld Adhesive 1386 -- 1386 [1386 from 3M]
from R. S. Hughes Company, Inc.

Very clear, fast setting, room temperature curing, two-part adhesive [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Features: UL Rating; Unfilled
3M™ Scotch-Weld Epoxy Adhesive DP100
from Total Plastics, Inc.

Clear. A very clear, two-part adhesive for bonding a variety of materials. 1.7 oz. tube. Bonds ceramics, wood and many metals and plastics. Available Sizes. 1.7 oz. tube [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
3M™ Scotch-Weld™ Epoxy Adhesive -- DP100 FR
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR is a flame retardant, two-part epoxy. 1:1 mix ratio, 3-5 minute work life and handling strength in 20 minutes. 3M ™ Scotch-Weld ™ EPX ™ 400 mL applicator. 3M ™ Scotch-Weld ™ Epoxy Adhesive DP100 FR meets UL94 V-0... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Features: Flame Retardant
1 Minute™ Fast Curing Epoxy Gel -- 14277 [14277 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood
  • Type / Form: Gel
  • Cure / Technology: Two Component  
  • Industry: Construction; OEM or Industrial
Ready-Stick™ Epoxy Putty
from Anti-Seize Technology

Can be tapped drilled and painted, steel hard in 20 minutes [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Wood
  • Features: Filled (optional feature); Unfilled
  • Cure / Technology: Thermoset; Single Component
  • Industry: Marine; Construction
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal
  • Features: Electrically Conductive; Thermally Conductive; Filled
  • Cure / Technology: Thermoset
  • Industry: Electronics; OEM or Industrial
Hardman<reg> Epoxy and Urethane Ad -- GO-08778-02
from Cole-Parmer

Epoxy,quick-set, 10/pk. Complete selection of epoxies for all your maintenance needs. Single-use adhesives are perfect for quick repair jobs. Applications: Wood, metal, glass, stone, concrete, and leather. Model: 4001-BG10. Manufacturer number: 4001-BG10. Temperature range (*F): -20 to 180 &176;F. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood; Leather
  • Use Temperature: -20 to 180
  • Cure / Technology: Thermoset
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured
  • Features: Encapsulant, Potting Compound
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: High Dielectric; Unfilled
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
  • Features: Encapsulant, Potting Compound; Unfilled
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: OEM or Industrial
Hysol® Die Attach Adhesive -- KO0125
from Henkel Corporation - Electronics

Withstands polymer decomposition during reflow [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Cu, Pd, Ag, and Au Plating
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component
  • Features: Electrically Conductive; Filled
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled
Epoxy Adhesive -- E103
from Koford Engineering, LLC

E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Use Temperature: 257 to 356
  • Cure / Technology: Thermoset; Single Component
Electro-Conductive Epoxy Adhesive -- ACE-10131
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal
  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
2367995
from RS Components, Ltd.

Product Category:Adhesive; Primary Application Category:Bonding Metals, Fabrics, Ceramics, Glass, Wood and Concrete; Material:Epoxy; Curing Type:Rapid; Pack Type:Cartridge; Pack Size:50ml [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Wood