COMMERCIAL TRANSPORTATION BETAMATE™ Structural Adhesive
from Dow Automotive Systems

Providing Strong Bonds Without Heat Curing. BETAMATE ™ semi-structural adhesives are designed to bond a variety of substrates, including dissimilar materials, to provide high performance adhesion. Using next-generation epoxy- and rubber-based adhesive technology, BETAMATE semi-structural... [See More]

  • Substrate Compatibility: Composites; Metal; Plastic
  • Industry: Automotive
Permabond Anaerobic Threadlocker -- HH120 50ML BOTTLE
from Ellsworth Adhesives

PERMABOND HH120 Threadlocker is an excellent general-purpose threadlocker and sealant. Sold as a pack (10/pk). [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; Automotive; Construction; OEM or Industrial; Appliances
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Features: Flexible; Unfilled
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoplastic / Hot Melt; Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: High Dielectric
3M™ Scotch-Weld™ LD Composite Surfacing Film -- AF-163 2XS
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Low Density Composite Surfacing Film AF 163 2XS is thermosetting, laminated metal foil films that adheres to cold and release coated tools. [See More]

  • Substrate Compatibility: Composites
  • Industry: Aerospace; OEM or Industrial
  • Cure / Technology: Thermoset; Single Component
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured
  • Features: Encapsulant, Potting Compound
Electrically Insulating Epoxy Adhesive -- 50-3122
from Epoxies Etc...

50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]

  • Substrate Compatibility: Composites; Metal; Plastic
  • Features: High Dielectric; Thermally Conductive; Filled
  • Cure / Technology: Thermoset; Single Component
  • Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
MAGNOBOND 6398
from Glotrax Polymers Inc.

Magnobond 6398, Parts A & B is a two component thixotropic paste epoxy system designed for bonding metals and composite structures. Magnobond 6398 has good properties at high and low temperatures using a room temperature cure. Applications include insertion filling, composite repair manfacture, and... [See More]

  • Substrate Compatibility: Composites; Metal
  • Features: Unfilled
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; Automotive
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
  • Features: Encapsulant, Potting Compound; Unfilled
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: OEM or Industrial
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled