2 Ton®Clear Epoxy -- 14310 [14310 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Features: Unfilled
Oxetane Series -- OXT-101
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)

ARON OXETANE is the brand name for oxetane resin that was commercialized by TOAGOSEI earlier than any other business in the world. Falling under the category of cationic curable resins, it is chiefly used in combination with epoxy resin. [See More]

  • Substrate Compatibility: Metal
  • Type / Form: Liquid
  • Cure / Technology: Two Component   (optional feature); UV or Radiation Cured; Single Component
  • Viscosity: 22.4
BETAMATE™ 1021 One-Part, High Performance, Heat Curing, Fracture-Toughened Epoxy Adhesive
from Dow Automotive Systems

BETAMATE 1021 is a one-part, high performance, heat curing, fracture-toughened epoxy adhesive. It is capable of bonding oily galvanized steel and cold rolled steel and provides excellent long term durability. It also has good impact-peel strength as measured by ISO 11343. [See More]

  • Substrate Compatibility: Metal
  • Features: Unfilled
  • Cure / Technology: Thermoset; Single Component
  • Industry: Automotive
Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Features: High Dielectric; UL Rating; Unfilled
FTLV with HARDENER Casting System Kit -- 90-004074
from Ellsworth Adhesives

Sold as a case (4 Kits/case). OXY-CAST 6850 FTLV with HARDENER XL is a low viscosity, versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. Gallon kit. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: High Dielectric; Encapsulant, Potting Compound
Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Features: Electrically Conductive; EMI/RFI Shielding; Filled
Hapweld™ 661 A/B Performance Structural Adhesive System -- 661 A/B
from Hapco, Inc.

Two-part, high strength, epoxy adhesive system designed for the structural bonding of metals and plastics. It has proven especially advantageous in such textile equipment applications as metallic wire bonding, and metal comb re-needling. The particular advantages of HAPWELD ™ 661 are its... [See More]

  • Substrate Compatibility: Metal; Plastic; Textiles or Fabrics
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Viscosity: 72 to 200
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Features: Flexible; Unfilled
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
  • Cure / Technology: Two Component  
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
Thermally Conductive Epoxy -- OB-100 / OB-200 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Wood
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Features: High Dielectric; Thermally Conductive
Scotch-Weld Adhesive 1386 -- 1386 [1386 from 3M]
from R. S. Hughes Company, Inc.

Very clear, fast setting, room temperature curing, two-part adhesive [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Features: UL Rating; Unfilled
3M™ Scotch-Weld Epoxy Adhesive 2216 B/A
from Total Plastics, Inc.

Grey. A two-part adhesive kit (2/3 full container of base, 1 full container of accelerator). 1 Quart. Bonds rubber, metal, wood, plastic and masonry. Available Sizes. 1 Quart [See More]

  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
3M™ Scotch-Weld™ Epoxy Adhesive -- 1838
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent environmental resistance. [See More]

  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Wood
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Aerospace; OEM or Industrial
3M™ Scotch-Weld™ Adhesive -- DP-460 EG
from 3M Electronics Design & Manufacturing

Two-part room-temperature-curing epoxy with high durability, 4500 psi OLS, and 50 PIW on aluminum. Reaches handling strength in 4-6 hours. Lower ionic and outgassing impurities than typical epoxies. 2:1 ratio. [See More]

  • Substrate Compatibility: Metal
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Electronics
1 Minute™ Fast Curing Epoxy Gel -- 14277 [14277 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood
  • Type / Form: Gel
  • Cure / Technology: Two Component  
  • Industry: Construction; OEM or Industrial
Ready-Stick™ Epoxy Putty
from Anti-Seize Technology

Can be tapped drilled and painted, steel hard in 20 minutes [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Wood
  • Features: Filled (optional feature); Unfilled
  • Cure / Technology: Thermoset; Single Component
  • Industry: Marine; Construction
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal
  • Features: Electrically Conductive; Thermally Conductive; Filled
  • Cure / Technology: Thermoset
  • Industry: Electronics; OEM or Industrial
Rezklad Machine Adhesive
from Atlas Minerals and Chemicals, Inc.

Bond coat to adhere equipment bases and metal plates to concrete or masonry substrates [See More]

  • Substrate Compatibility: Concrete, Masonry; Metal
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Industry: Automotive; Machinery Adhesive
Hardman<reg> Epoxy and Urethane Ad -- GO-08778-02
from Cole-Parmer

Epoxy,quick-set, 10/pk. Complete selection of epoxies for all your maintenance needs. Single-use adhesives are perfect for quick repair jobs. Applications: Wood, metal, glass, stone, concrete, and leather. Model: 4001-BG10. Manufacturer number: 4001-BG10. Temperature range (*F): -20 to 180 &176;F. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood; Leather
  • Use Temperature: -20 to 180
  • Cure / Technology: Thermoset
Fast Steel Epoxy Putty -- PTY204
from Dawg, Inc.

Epoxy Putty is designed for a specific type of application. All Epoxy Putty compounds can be drilled, tapped, filed, machined, screwed, sawed, sanded, or painted. Epoxy putty sticks are 7" in length . Fast Steel Steel Epoxy Putty - Rebuild engine parts, mufflers, radiators, metal tools-patch ducts... [See More]

  • Substrate Compatibility: Metal
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured
  • Features: Encapsulant, Potting Compound
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: High Dielectric; Unfilled
MAGNOBOND 6398
from Glotrax Polymers Inc.

Magnobond 6398, Parts A & B is a two component thixotropic paste epoxy system designed for bonding metals and composite structures. Magnobond 6398 has good properties at high and low temperatures using a room temperature cure. Applications include insertion filling, composite repair manfacture, and... [See More]

  • Substrate Compatibility: Composites; Metal
  • Features: Unfilled
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; Automotive
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
  • Features: Encapsulant, Potting Compound; Unfilled
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: OEM or Industrial
Hysol® Die Attach Adhesive -- KO0125
from Henkel Corporation - Electronics

Withstands polymer decomposition during reflow [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Cu, Pd, Ag, and Au Plating
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component
  • Features: Electrically Conductive; Filled
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled
Epoxy Adhesive -- E103
from Koford Engineering, LLC

E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Use Temperature: 257 to 356
  • Cure / Technology: Thermoset; Single Component
Epoxy-Lock®
from ND Industries, Inc.

Meets IFI 125 & 525 standards, exceptional locking power [See More]

  • Substrate Compatibility: Metal
  • Type / Form: Liquid
  • Cure / Technology: Single Component
  • Features: Solvent Based; Threadlocker or Retainer
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Substrate Compatibility: Metal
  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
2367995
from RS Components, Ltd.

Product Category:Adhesive; Primary Application Category:Bonding Metals, Fabrics, Ceramics, Glass, Wood and Concrete; Material:Epoxy; Curing Type:Rapid; Pack Type:Cartridge; Pack Size:50ml [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Wood