Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Features: High Dielectric; UL Rating; Unfilled
OXY-BOND 105 Five-Minute Epoxy Adhesive -- 90-001353
from Ellsworth Adhesives

OXY-BOND 105 is an exceptional epoxy formulation, recommended for lower temperature or wet industrial bonding applications where fast curing is required.50ml. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Wood
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: High Dielectric
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
Thermally Conductive Epoxy -- OB-100 / OB-200 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Wood
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Features: High Dielectric; Thermally Conductive
Adhesive and encapsulating resin -- 60-7170R
from Epoxies Etc...

UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant
GSP 1414
from GS Polymers, Inc.

Two part, 1:4, temperatures to 230 °F, good hydrolytic stability, FDA [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates; Variety
  • Features: Unfilled
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Sanitary; OEM or Industrial