from 3M Industrial Adhesives & Tapes Canada
3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy adhesive. 4:5 mix ratio, 60 minute work life and handling strength in approximately 8 hours. This kit contains 1.6 fl. oz. of part B and 2 fl. oz. of part A. 60 minute worklife. High viscosity. Rigid bonds. General... [See More]
- Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Wood
- Industry: Electronics; Military; Construction; OEM or Industrial
- Cure / Technology: Two Component
- Viscosity: 400000
- 3M™ Scotch-Weld™ Epoxy Adhesive 1838L Translucent, Part B/A, 2 fl oz Tube Kit, 6 per case -- 62352005359,
- 3M™ Scotch-Weld™ Epoxy Adhesive 2214 Hi-Density Gray, 6 fl oz Plastic Cartridge, 6 per case -- 62341429306,
- 3M™ Scotch-Weld™ Epoxy Adhesive 2214 Hi-Temp Gray, 6 fl oz, 6 per case -- 62340229301,
from Applied Industrial Technologies
Bonds virtually any material to repair, fill, and seal holes, cracks, etc.. [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Wood; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Two Component
- Features: Flame Retardant; Leveling Filling; Unfilled
from Dow Automotive Systems
BETAMATE 1484LTC is a one-part, high performance, heat curing, fracture-toughened epoxy adhesive. It is designed for bonding automotive vehicle structures. It is a crash durable adhesive designed to give superior failure mode in all modes of testing. It has experienced toughness for an epoxy... [See More]
- Substrate Compatibility: Metal; Plastic
- Features: Unfilled
- Cure / Technology: Thermoset; Single Component
- Industry: Automotive
from ELANTAS PDG, Inc.
Trickle resin system for impregnation or protective overcoat [See More]
- Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Features: High Dielectric; UL Rating; Unfilled
from Ellsworth Adhesives
3M Scotch-Weld 1838 two-part, room temperature curing structural adhesives with high shear strengths and excellent environmental resistance. 2 ounce tube kit. [See More]
- Substrate Compatibility: Metal; Plastic; Rubber or Elastomer; Wood
- Industry: OEM or Industrial
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Elongation: 2.0 to 3.0
from Epoxy Technology
EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]
- Substrate Compatibility: Metal; Plastic
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Features: EMI/RFI Shielding; Filled
from Hapco, Inc.
Two-part, high strength, epoxy adhesive system designed for the structural bonding of metals and plastics. It has proven especially advantageous in such textile equipment applications as metallic wire bonding, and metal comb re-needling. The particular advantages of HAPWELD ™ 661 are its... [See More]
- Substrate Compatibility: Metal; Plastic; Textiles or Fabrics
- Type / Form: Liquid
- Cure / Technology: Two Component
- Viscosity: 72 to 200
from ITW Polymer Technologies - Insulcast Division
INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
- Features: Flexible; Unfilled
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
- Cure / Technology: Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Wood
- Type / Form: Liquid
- Cure / Technology: Two Component
- Features: High Dielectric; Thermally Conductive
from R. S. Hughes Company, Inc.
Very clear, fast setting, room temperature curing, two-part adhesive [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Type / Form: Gel
- Cure / Technology: Thermoset; Two Component
- Features: UL Rating; Unfilled
from Anti-Seize Technology
Can be tapped drilled and painted, steel hard in 20 minutes [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Wood
- Features: Filled (optional feature); Unfilled
- Cure / Technology: Thermoset; Single Component
- Industry: Marine; Construction
from Cole-Parmer
Epoxy, General Purpose 10/pk. Complete selection of epoxies for all your maintenance needs. Single-use adhesives are perfect for quick repair jobs. Applications: Wood, metal, plastic, rubber, fiberglass, cloth and ceramic. Model: 4005-BG10. Manufacturer number: 4005-BG10. Temperature range (*F): -30... [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood
- Use Temperature: -30 to 200
- Cure / Technology: Thermoset
from Dawg, Inc.
Epoxy Putty is designed for a specific type of application. All Epoxy Putty compounds can be drilled, tapped, filed, machined, screwed, sawed, sanded, or painted. Epoxy putty sticks are 7" in length . Quik Plastic Plastic Epoxy Putty repairs rigid & semi-flexible plastic, automotive trim, appliance... [See More]
- Substrate Compatibility: Plastic
from Electro-Lite Corporation
ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured
- Features: Encapsulant, Potting Compound
from GS Polymers, Inc.
Two part, 4:1 adhesive with impact resistance [See More]
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Plastic (optional feature); Porous Surfaces; Dissimilar Substrates; Stainless Steel
- Features: Filled
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Construction; OEM or Industrial
from Koford Engineering, LLC
E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Use Temperature: 257 to 356
- Cure / Technology: Thermoset; Single Component
from Protavic America, Inc.
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Type / Form: Liquid
- Cure / Technology: Thermoset; Single Component
- Features: High Dielectric; Thermally Conductive
