3M™ Scotch-Weld™ Epoxy Adhesive 1838 Green, Part B/A, 2 fl oz Kit, 6 per case -- 62183805308
from 3M Industrial Adhesives & Tapes Canada

3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy adhesive. 4:5 mix ratio, 60 minute work life and handling strength in approximately 8 hours. This kit contains 1.6 fl. oz. of part B and 2 fl. oz. of part A. 60 minute worklife. High viscosity. Rigid bonds. General... [See More]

  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Wood
  • Industry: Electronics; Military; Construction; OEM or Industrial
  • Cure / Technology: Two Component  
  • Viscosity: 400000
General Purpose Industrial Epoxy/Resin -- INSTAbond® 81C
from ACCRAbond, Inc.

INSTAbond ® 81C. General purpose adhesive that bonds and repairs a variety of materials including metals, most plastics and wood. The cured compound is machinable and sandable, and has high service temperature and excellent environmental resistance. [See More]

  • Substrate Compatibility: Metal; Plastic; Wood
  • Cure / Technology: Two Component  
Fixmaster® Fast Cure Poxy Pak™ -- 81120 [81120 from Henkel Corporation]
from Applied Industrial Technologies

Bonds virtually any material to repair, fill, and seal holes, cracks, etc.. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Features: Flame Retardant; Leveling Filling; Unfilled
BETAMATE™ 1484LTC One-Part, High Performance, Heat Curing, Fracture-Toughened Epoxy Adhesive
from Dow Automotive Systems

BETAMATE 1484LTC is a one-part, high performance, heat curing, fracture-toughened epoxy adhesive. It is designed for bonding automotive vehicle structures. It is a crash durable adhesive designed to give superior failure mode in all modes of testing. It has experienced toughness for an epoxy... [See More]

  • Substrate Compatibility: Metal; Plastic
  • Features: Unfilled
  • Cure / Technology: Thermoset; Single Component
  • Industry: Automotive
Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Features: High Dielectric; UL Rating; Unfilled
3M Scotch-Weld 1838 Epoxy Adhesive Green 2oz Kit A/B -- 1838 GREEN 2 OZ TUBE KIT
from Ellsworth Adhesives

3M Scotch-Weld 1838 two-part, room temperature curing structural adhesives with high shear strengths and excellent environmental resistance. 2 ounce tube kit. [See More]

  • Substrate Compatibility: Metal; Plastic; Rubber or Elastomer; Wood
  • Industry: OEM or Industrial
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Elongation: 2.0 to 3.0
Electrially Insulative Epoxy -- OD1001
from Epoxy Technology

A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics; Optical; Photonics; Semiconductors, IC's
Hapweld™ 661 A/B Performance Structural Adhesive System -- 661 A/B
from Hapco, Inc.

Two-part, high strength, epoxy adhesive system designed for the structural bonding of metals and plastics. It has proven especially advantageous in such textile equipment applications as metallic wire bonding, and metal comb re-needling. The particular advantages of HAPWELD ™ 661 are its... [See More]

  • Substrate Compatibility: Metal; Plastic; Textiles or Fabrics
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Viscosity: 72 to 200
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Features: Flexible; Unfilled
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
  • Cure / Technology: Two Component  
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
Thermally Conductive Epoxy -- OB-100 / OB-200 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Paper or Paperboard; Plastic; Rubber or Elastomer; Wood
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Features: High Dielectric; Thermally Conductive
Scotch-Weld Adhesive 1386 -- 1386 [1386 from 3M]
from R. S. Hughes Company, Inc.

Very clear, fast setting, room temperature curing, two-part adhesive [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Features: UL Rating; Unfilled
3M™ Scotch-Weld™ Epoxy Adhesive -- 1838
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M ™ Scotch-Weld ™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent environmental resistance. [See More]

  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Wood
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Aerospace; OEM or Industrial
Double/Bubble® Epoxy Adhesive -- 4005 [4005 from Royal Adhesives and Sealants LLC]
from All-Spec Industries

"//www.youtube.com/watch?v=wvxiOBwXWF4"" > Hardman Double/Bubble Epoxy Demonstration" [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
  • Type / Form: Gel
  • Cure / Technology: Two Component  
  • Viscosity: 30000
Ready-Stick™ Epoxy Putty
from Anti-Seize Technology

Can be tapped drilled and painted, steel hard in 20 minutes [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Wood
  • Features: Filled (optional feature); Unfilled
  • Cure / Technology: Thermoset; Single Component
  • Industry: Marine; Construction
Pyro-Weld™ -- 657-FST
from Aremco Products, Inc.

Curing takes place at room temperature in 30-45 minutes [See More]

  • Substrate Compatibility: Metal; Plastic
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
  • Features: Unfilled
Hardman<reg> Epoxy and Urethane Ad -- GO-08778-06
from Cole-Parmer

Epoxy, General Purpose 10/pk. Complete selection of epoxies for all your maintenance needs. Single-use adhesives are perfect for quick repair jobs. Applications: Wood, metal, plastic, rubber, fiberglass, cloth and ceramic. Model: 4005-BG10. Manufacturer number: 4005-BG10. Temperature range (*F): -30... [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood
  • Use Temperature: -30 to 200
  • Cure / Technology: Thermoset
Quik Plastic Epoxy Putty -- PTY201
from Dawg, Inc.

Epoxy Putty is designed for a specific type of application. All Epoxy Putty compounds can be drilled, tapped, filed, machined, screwed, sawed, sanded, or painted. Epoxy putty sticks are 7" in length . Quik Plastic Plastic Epoxy Putty repairs rigid & semi-flexible plastic, automotive trim, appliance... [See More]

  • Substrate Compatibility: Plastic
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured
  • Features: Encapsulant, Potting Compound
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: High Dielectric; Unfilled
GSP 1710
from GS Polymers, Inc.

Two part, 4:1 adhesive with impact resistance [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Plastic (optional feature); Porous Surfaces; Dissimilar Substrates; Stainless Steel
  • Features: Filled
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Construction; OEM or Industrial
Tuffbond™ -- 305
from Hernon Manufacturing, Inc.

Tuffbond „ ¢ epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Phase Change; Sealant; Unfilled
Epoxy Adhesive -- E103
from Koford Engineering, LLC

E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Use Temperature: 257 to 356
  • Cure / Technology: Thermoset; Single Component
Epoxy Adhesive -- ANE-20904
from Protavic America, Inc.

Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Single Component
  • Features: High Dielectric; Thermally Conductive
2368061
from RS Components, Ltd.

Product Category:Adhesive; Primary Application Category:Bonding Thermoplastics; Phenolics; Urethanes; Aluminium; Steel; SMC Composites; Laminates; Ceramics; Material:Epoxy Plus; Pack Type:Cartridge; Pack Size:50ml [See More]

  • Substrate Compatibility: Plastic