Epoxylite® -- E 810-1 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Sets at R.T. with E 810-1 Accelerator
  • Substrate Compatibility: Dissimilar Substrates
  • Type / Form: Liquid
  • Features: High Dielectric; Laminaes; Non-corrosive; Sealant; Filled
3M Scotch-Weld 1751 Epoxy Adhesive Gray Quart Kit A/B -- 1751 QUART KIT
from Ellsworth Adhesives

3M Scotch-Weld 1751 gray, aluminum filled, two-part, room temperature curing structural adhesive. Quart kit. Sold as pack (6 kits/pack). [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: OEM or Industrial
  • Substrate Compatibility: Metal
Electrical -- EJ2189
from Epoxy Technology

An electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80 °C, although other heat cures can be used. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: Electrically Conductive; EMI/RFI Shielding; Thermally Conductive; Filled
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Industry: Electronics; Photonics; Semiconductors, IC's
Haprez™ 3742 General Purpose Epoxy Laminating Binder System -- 3742
from Hapco, Inc.

An economical, general purpose, epoxy laminating and binder system. A clear amber, general purpose system that can be used with a variety of fillers for virtually all room temperature casting and laminating applications. As a laminating system, the extremely low viscosity of HAPREZ ™ 3742... [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: Encapsulant, Potting Compound; Laminaes
  • Type / Form: Liquid
  • Industry: Tooling
RTVS 42 CURTIS II Silicone-Epoxy Copolymer Potting/Casting Compound
from ITW Polymer Technologies - Insulcast Division

RRTVS 42 CURTIS II is a low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, low moisture absorption and excellent dielectric insulation. RTVS 42 CURTIS II contains silane adhesion promoters that enable it to bond well to most metals and plastics. Its unique... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: Encapsulant, Potting Compound; Flame Retardant; Sealant; Thermally Conductive; Filled
  • Substrate Compatibility: Plastic
  • Industry: Aerospace; Automotive; Electronics; Military; Construction; OEM or Industrial; Electronic Encapsulants
Abrasion Resistant Cryogenic Epoxy Urethane System -- EP30DP
from Master Bond, Inc.

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates
  • Type / Form: Liquid
  • Features: High Dielectric
3M™ Scotch-Weld Epoxy Adhesive 2216 B/A
from Total Plastics, Inc.

Grey. A two-part adhesive kit (2/3 full container of base, 1 full container of accelerator). 1 Quart. Bonds rubber, metal, wood, plastic and masonry. Available Sizes. 1 Quart [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
  • Type / Form: Liquid
3M™ Scotch-Weld™ Adhesive And Sealant Kit -- 3537
from 3M Aerospace and Aircraft Maintenance Division

Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Aerospace; OEM or Industrial
  • Features: Sealant; Flexible
3M™ Scotch-Weld™ Adhesive -- DP-460 EG
from 3M Electronics Design & Manufacturing

Two-part room-temperature-curing epoxy with high durability, 4500 psi OLS, and 50 PIW on aluminum. Reaches handling strength in 4-6 hours. Lower ionic and outgassing impurities than typical epoxies. 2:1 ratio. [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Metal
  • Type / Form: Liquid
  • Industry: Electronics
Epoxy Conductive Adhesive + Hardener -- CW2400 [CW2400 from ITW Chemtronics]
from All-Spec Industries

The CircuitWorks CW2400 is a two-part conductive epoxy for precision repair and high-strength conductive bonding. [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: Electrically Conductive
  • Substrate Compatibility: Metal
  • Industry: Electronics
Aremco-Bond™ -- 616
from Aremco Products, Inc.

Aremco-Bond ™ 616 [See More]

  • Cure / Technology: Thermoset (optional feature); Room Temperature Vulcanizing or Curing (optional feature)
  • Features: Electrically Conductive; Thermally Conductive; Filled
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Industry: Electronics; OEM or Industrial
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Type / Form: Liquid
  • Features: High Dielectric; Unfilled
FIS Epoxy for Connectorization -- H15-080-RX
from Fiber Instrument Sales, Inc./FIS

Heat cure only, cures in 15 minutes. [See More]

  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Industry: Fiber Optic Connections
  • Type / Form: Liquid
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: Encapsulant, Potting Compound; Unfilled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
  • Industry: OEM or Industrial
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled