from 3M Industrial Adhesives & Tapes Canada
3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 Hi-Density is a gray, deaerated, rigid, aluminum filled, one-part epoxy adhesive. Cures in 40 minutes at 250 Degrees F/121 Degrees C. Deaerated, dense bonds. Heat cure. High performance on metals and composites. General industrial, sporting goods,... [See More]
- Cure / Technology: Single Component
- Industry: Electronics; Military; Construction; OEM or Industrial
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Viscosity: 1.00E6
from Applied Industrial Technologies
- Cure / Technology: Single Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Textiles or Fabrics; Wood
- Type / Form: Gel
- Features: Unfilled
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)
ARONIX is the brand name of specific acrylic monomers and oligomers produced by TOAGOSEI. ARONIX is classified into three grades: special acrylates, urethan acrylates and polyester acrylates. ARONIX is commonly used for UV-curing inks, UV-curing paints, and UV-curing adhesives through single or... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
from Dow Automotive Systems
BETAMATE 1021 is a one-part, high performance, heat curing, fracture-toughened epoxy adhesive. It is capable of bonding oily galvanized steel and cold rolled steel and provides excellent long term durability. It also has good impact-peel strength as measured by ISO 11343. [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Unfilled
- Substrate Compatibility: Metal
- Industry: Automotive
from Ellsworth Adhesives
ECCOBOND Paste 99 is a one component heat cured, thixotropic non-sag epoxy adhesive paste; it has excellent thermal conductivity and electrical insulation, good chemical resistance, and a low coefficient of thermal expansion. 15 lb can. Sold as a case (4/case). [See More]
- Cure / Technology: Single Component
- Industry: OEM or Industrial
- Substrate Compatibility: Ceramic, Glass; Metal
- Use Temperature: -40 to 347
from Epoxy Technology
A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a one month pot-life, low temperature cure, and syringe dispensing rheology. It can be used for electrical connections when... [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Electrically Conductive; Thermally Conductive; Filled
- Substrate Compatibility: Metal; Plastic
- Industry: Electronics; Semiconductors, IC's
from ITW Polymer Technologies - Insulcast Division
INSULCAST 771 is a clear, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. [See More]
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Plastic
- Type / Form: Liquid
- Features: Thermal Insulation; Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP19M is a high performance epoxy resin formulation specially formulated to bond to treated fluoropolymer and other difficult to bond surfaces. It is supplied as a single component low viscosity compound and requires cure at elevated temperatures in order to obtain high... [See More]
- Cure / Technology: Thermoset; Single Component
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Unfilled
- Substrate Compatibility: Fluoropolymer/Difficult to Bond Surfaces
- Industry: Electronics; Electric Power
from R. S. Hughes Company, Inc.
3M(TM) Scotch-Weld(TM) Epoxy Adhesive 1386 Cream, 12 per case qt. Eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for metal to metal bonding provides exceptionally high strength, impact resistant bonds. Meets requirements of MMM-A-134... [See More]
- Cure / Technology: Single Component
from Anti-Seize Technology
Can be tapped drilled and painted, steel hard in 20 minutes [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Filled (optional feature); Unfilled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Wood
- Industry: Marine; Construction
from GS Polymers, Inc.
One part, thixotropic adhesive, chemical resistance, heat cure [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Filled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
- Industry: OEM or Industrial
from Henkel Corporation - Electronics
Designed for high speed printing and dispensing [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Thermal Insulation; Filled
- Type / Form: Gel
- Industry: Electronics
from Koford Engineering, LLC
E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]
- Cure / Technology: Thermoset; Single Component
- Use Temperature: 257 to 356
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from ND Industries, Inc.
Meets IFI 125 & 525 standards, exceptional locking power [See More]
- Cure / Technology: Single Component
- Substrate Compatibility: Metal
- Type / Form: Liquid
- Features: Solvent Based; Threadlocker or Retainer
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
- Substrate Compatibility: Metal
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
