Single Component System Epoxy Adhesives Datasheets

5-Minute®Epoxy -- 14210 [14210 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Cure / Technology: Single Component
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Textiles or Fabrics; Wood
  • Type / Form: Gel
  • Features: Unfilled
Aron Alpha Type 414TXZ -- AA900
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)

ARON ALPHA TYPE 414TXZ is a one component (requires no mixing), humidity cure, thixotropic gel viscosity, rubber toughened instant adhesive with increased flexibility and peel strength along with enhanced resistance to shock and thermal cycling. The product provides rapid bonding on a wide range of... [See More]

  • Cure / Technology: Single Component
  • Viscosity: 6000
  • Type / Form: Liquid
  • Gap Fill: 0.0040
Emerson & Cuming ECCOBOND 99 Epoxy Adhesive Black 15 lb -- PASTE 99 BLK 15#
from Ellsworth Adhesives

ECCOBOND Paste 99 is a one component heat cured, thixotropic non-sag epoxy adhesive paste; it has excellent thermal conductivity and electrical insulation, good chemical resistance, and a low coefficient of thermal expansion. 15 lb can. Sold as a case (4/case). [See More]

  • Cure / Technology: Single Component
  • Industry: OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Use Temperature: -40 to 347
Black, Single Component, Low Halogen, Electrically Insulating Die Attach Adhesive -- EPO-TEK® TJ1104-LH
from Epoxy Technology

A black, single component, low halogen, electrically insulating die attach adhesive with extended pot life. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: High Dielectric; Thermally Conductive; Filled
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Industry: Electronics; Photonics; Semiconductors, IC's
HYSOL ECCOBOND G500 -- 8799575834625
from Henkel Corporation - Electronics

HYSOL ECCOBOND G500 is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. It is used as insulation of copper and other materials and attaching leads to coils. [See More]

  • Cure / Technology: Single Component
  • Industry: Electronics
Fast Curing, One Component Epoxy System -- EP3HT
from Master Bond, Inc.

Master Bond Polymer System EP3HT is a one component system featuring high shear strength, good temperature resistance along with a fast cure schedule. Typical curing schedules are 5-10 minutes at 300 °F or 20-30 minutes at 250 °F (minimum cure temperature is 235 °F-240 °F). Tensile... [See More]

  • Cure / Technology: Single Component
  • Features: Sealant; Unfilled
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
  • Industry: Marine; OEM or Industrial
3M(TM) Scotch-Weld(TM) Epoxy Adhesive 1386 Cream, 12 per case qt -- 021200-19917
from R. S. Hughes Company, Inc.

3M(TM) Scotch-Weld(TM) Epoxy Adhesive 1386 Cream, 12 per case qt. Eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for metal to metal bonding provides exceptionally high strength, impact resistant bonds. Meets requirements of MMM-A-134... [See More]

  • Cure / Technology: Single Component
3M™ Scotch-Weld™ Epoxy Adhesive -- EC-2214
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense void-free bond lines. High... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Filled
  • Substrate Compatibility: Metal; Plastic
  • Industry: Aerospace; OEM or Industrial
Aluminum Putty -- 10610 [10610 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Cure / Technology: Single Component
  • Features: Filled
  • Substrate Compatibility: Concrete, Masonry; Metal
  • Industry: Construction; OEM or Industrial
Adhesive and encapsulating resin -- 60-7170R
from Epoxies Etc...

UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Type / Form: Liquid
  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant
GSP EP 200
from GS Polymers, Inc.

One part, thixotropic adhesive, chemical resistance, heat cure [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Filled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
  • Industry: OEM or Industrial
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled
INSULCAST 771 One Component, Rigid, Heat Cure Epoxy System
from ITW Polymer Technologies - Insulcast Division

INSULCAST 771 is a clear, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Substrate Compatibility: Plastic
  • Type / Form: Liquid
  • Features: Thermal Insulation; Unfilled
Epoxy Adhesive -- E103
from Koford Engineering, LLC

E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Use Temperature: 257 to 356
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Epoxy-Lock®
from ND Industries, Inc.

Meets IFI 125 & 525 standards, exceptional locking power [See More]

  • Cure / Technology: Single Component
  • Substrate Compatibility: Metal
  • Type / Form: Liquid
  • Features: Solvent Based; Threadlocker or Retainer
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
  • Substrate Compatibility: Metal
  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's