3M™ Scotch-Weld™ Epoxy Adhesive 2214 Hi-Density Gray, 6 fl oz Plastic Cartridge, 6 per case -- 62341429306
from 3M Industrial Adhesives & Tapes Canada

3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 Hi-Density is a gray, deaerated, rigid, aluminum filled, one-part epoxy adhesive. Cures in 40 minutes at 250 Degrees F/121 Degrees C. Deaerated, dense bonds. Heat cure. High performance on metals and composites. General industrial, sporting goods,... [See More]

  • Cure / Technology: Single Component
  • Industry: Electronics; Military; Construction; OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Viscosity: 1.00E6
Conap™ Industrial Adhesive -- CONAPOXY® AD-10
from ACCRAbond, Inc.

CONAPOXY ® AD-10 is a unique single component epoxy that may be used as a structural adhesive or miniature electronic potting compound. The heat-cure formulation was designed for rapid cure at temperatures as low as 200 °F, yet it exhibits good storage life at room temperature. Good... [See More]

  • Cure / Technology: Single Component
5-Minute®Epoxy -- 14210 [14210 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Cure / Technology: Single Component
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Textiles or Fabrics; Wood
  • Type / Form: Gel
  • Features: Unfilled
Aronix M-Series -- M-101A
from Aron Alpha Industrial Krazy Glue (Toagosei America, Inc.)

ARONIX is the brand name of specific acrylic monomers and oligomers produced by TOAGOSEI. ARONIX is classified into three grades: special acrylates, urethan acrylates and polyester acrylates. ARONIX is commonly used for UV-curing inks, UV-curing paints, and UV-curing adhesives through single or... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
BETAMATE™ 1021 One-Part, High Performance, Heat Curing, Fracture-Toughened Epoxy Adhesive
from Dow Automotive Systems

BETAMATE 1021 is a one-part, high performance, heat curing, fracture-toughened epoxy adhesive. It is capable of bonding oily galvanized steel and cold rolled steel and provides excellent long term durability. It also has good impact-peel strength as measured by ISO 11343. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Unfilled
  • Substrate Compatibility: Metal
  • Industry: Automotive
Emerson & Cuming ECCOBOND 99 Epoxy Adhesive Black 15 lb -- PASTE 99 BLK 15#
from Ellsworth Adhesives

ECCOBOND Paste 99 is a one component heat cured, thixotropic non-sag epoxy adhesive paste; it has excellent thermal conductivity and electrical insulation, good chemical resistance, and a low coefficient of thermal expansion. 15 lb can. Sold as a case (4/case). [See More]

  • Cure / Technology: Single Component
  • Industry: OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Use Temperature: -40 to 347
Electrially Insulative Epoxy -- OD1001
from Epoxy Technology

A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermal Insulation
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Industry: Electronics; Optical; Photonics; Semiconductors, IC's
INSULCAST 771 One Component, Rigid, Heat Cure Epoxy System
from ITW Polymer Technologies - Insulcast Division

INSULCAST 771 is a clear, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Substrate Compatibility: Plastic
  • Type / Form: Liquid
  • Features: Thermal Insulation; Unfilled
Epoxy For Bonding Treated Fluropolymers -- EP19M
from Master Bond, Inc.

Master Bond Polymer System EP19M is a high performance epoxy resin formulation specially formulated to bond to treated fluoropolymer and other difficult to bond surfaces. It is supplied as a single component low viscosity compound and requires cure at elevated temperatures in order to obtain high... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Unfilled
  • Substrate Compatibility: Fluoropolymer/Difficult to Bond Surfaces
  • Industry: Electronics; Electric Power
3M(TM) Scotch-Weld(TM) Epoxy Adhesive 1386 Cream, 12 per case qt -- 021200-19917
from R. S. Hughes Company, Inc.

3M(TM) Scotch-Weld(TM) Epoxy Adhesive 1386 Cream, 12 per case qt. Eliminates the mixing and weighing two part systems. This product must be heat cured. A 350 degree F curing epoxy for metal to metal bonding provides exceptionally high strength, impact resistant bonds. Meets requirements of MMM-A-134... [See More]

  • Cure / Technology: Single Component
3M™ Scotch-Weld™ Epoxy Adhesive -- EC-2214
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense void-free bond lines. High... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Filled
  • Substrate Compatibility: Metal; Plastic
  • Industry: Aerospace; OEM or Industrial
Aluminum Putty -- 10610 [10610 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Cure / Technology: Single Component
  • Features: Filled
  • Substrate Compatibility: Concrete, Masonry; Metal
  • Industry: Construction; OEM or Industrial
Ready-Stick™ Epoxy Putty
from Anti-Seize Technology

Can be tapped drilled and painted, steel hard in 20 minutes [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Filled (optional feature); Unfilled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Wood
  • Industry: Marine; Construction
Adhesive and encapsulating resin -- 60-7170R
from Epoxies Etc...

UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Type / Form: Liquid
  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant
GSP EP 200
from GS Polymers, Inc.

One part, thixotropic adhesive, chemical resistance, heat cure [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Filled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
  • Industry: OEM or Industrial
Chipbonder® Surface Mount Adhesive -- 3607
from Henkel Corporation - Electronics

Designed for high speed printing and dispensing [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Thermal Insulation; Filled
  • Type / Form: Gel
  • Industry: Electronics
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled
Epoxy Adhesive -- E103
from Koford Engineering, LLC

E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Use Temperature: 257 to 356
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Epoxy-Lock®
from ND Industries, Inc.

Meets IFI 125 & 525 standards, exceptional locking power [See More]

  • Cure / Technology: Single Component
  • Substrate Compatibility: Metal
  • Type / Form: Liquid
  • Features: Solvent Based; Threadlocker or Retainer
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
  • Substrate Compatibility: Metal
  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's