Aluminum Putty (F) General Repair Epoxy -- 10610 [10610 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Features: Filled
  • Substrate Compatibility: Concrete, Masonry; Metal
  • Cure / Technology: Single Component
  • Industry: Construction; OEM or Industrial
Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Sealant; Filled
  • Substrate Compatibility: Dissimilar Substrates
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; Electronics; Military; OEM or Industrial
Emerson & Cuming ECCOBOND 285 Adhesive Black 1 gal Pail -- 285 BLACK 18 LB.
from Ellsworth Adhesives

ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag epoxy adhesive paste; it has a low coefficient of thermal expansion and good bond strength. Cures with Catalyst 9 , or Catalyst 23LV , not included. 18 lb Gallon. [See More]

  • Features: Thermally Conductive; Filled
  • Industry: OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Use Temperature: -85 to 311
Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding; Filled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Features: Encapsulant, Potting Compound; Laminaes; Sealant; Flexible; Filled
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
3M™ Scotch-Weld™ Epoxy Adhesive -- EC-2214
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense void-free bond lines. High... [See More]

  • Features: Filled
  • Substrate Compatibility: Metal; Plastic
  • Cure / Technology: Thermoset; Single Component
  • Industry: Aerospace; OEM or Industrial
3M™ Thermally Conductive Adhesive -- TC-2707
from 3M Electronics Design & Manufacturing

3M ™ Thermally Conductive Epoxy Adhesive TC-2707 is an aluminum metal filled, two-part, thermally conductive epoxy adhesive. [See More]

  • Features: Thermally Conductive; Filled
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Industry: Electronics
Aluminum Putty -- 10610 [10610 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Features: Filled
  • Substrate Compatibility: Concrete, Masonry; Metal
  • Cure / Technology: Single Component
  • Industry: Construction; OEM or Industrial
Ready-Stick™ Epoxy Putty
from Anti-Seize Technology

Can be tapped drilled and painted, steel hard in 20 minutes [See More]

  • Features: Filled (optional feature); Unfilled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Wood
  • Cure / Technology: Thermoset; Single Component
  • Industry: Marine; Construction
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Features: Electrically Conductive; Thermally Conductive; Filled
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: Thermoset
  • Industry: Electronics; OEM or Industrial
Adjustable Flexibility Epoxy -- 10-3055
from Epoxies Etc...

10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible. [See More]

  • Features: High Dielectric; Flexible; Filled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Dissimilar Substrates
GSP 1339-2
from GS Polymers, Inc.

Two part, 4:1 thermal conductivity, higher visc., chemical & thermal res. [See More]

  • Features: Thermal Insulation; Filled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates; Wide Range of Substrates
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: OEM or Industrial
Chipbonder® Surface Mount Adhesive -- 3607
from Henkel Corporation - Electronics

Designed for high speed printing and dispensing [See More]

  • Features: Thermal Insulation; Filled
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
  • Substrate Compatibility: Metal
  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's