Filled Epoxy Adhesives Datasheets

Aluminum Putty (F) General Repair Epoxy -- 10610 [10610 from ITW Devcon]
from Applied Industrial Technologies

x [See More]

  • Features: Filled
  • Substrate Compatibility: Concrete, Masonry; Metal
  • Cure / Technology: Single Component
  • Industry: Construction; OEM or Industrial
Epoxylite® -- E 5302 Hi Temp Epoxy Kit
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Laminaes; Non-corrosive; Sealant; Filled
  • Substrate Compatibility: Dissimilar Substrates
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; Electronics; Military; OEM or Industrial
Black, Single Component, Low Halogen, Electrically Insulating Die Attach Adhesive -- EPO-TEK® TJ1104-LH
from Epoxy Technology

A black, single component, low halogen, electrically insulating die attach adhesive with extended pot life. [See More]

  • Features: High Dielectric; Thermally Conductive; Filled
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics; Photonics; Semiconductors, IC's
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Features: Encapsulant, Potting Compound; Laminaes; Sealant; Flexible; Filled
  • Type / Form: Liquid
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
3M™ Scotch-Weld™ Epoxy Adhesive -- EC-2214
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M ™ Scotch-Weld ™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense void-free bond lines. High... [See More]

  • Features: Filled
  • Substrate Compatibility: Metal; Plastic
  • Cure / Technology: Thermoset; Single Component
  • Industry: Aerospace; OEM or Industrial
Aluminum Putty -- 10610 [10610 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Features: Filled
  • Substrate Compatibility: Concrete, Masonry; Metal
  • Cure / Technology: Single Component
  • Industry: Construction; OEM or Industrial
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Features: Electrically Conductive; Thermally Conductive; Filled
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Cure / Technology: Thermoset
  • Industry: Electronics; OEM or Industrial
Adjustable Flexibility Epoxy -- 10-3055
from Epoxies Etc...

10-3055 is a filled epoxy adhesive system that allows the end user to adjust the flexibility of the cured adhesive. By simply varying the amount of hardener, the durometer can be adjusted from rigid to flexible. [See More]

  • Features: High Dielectric; Flexible; Filled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Dissimilar Substrates
GSP 1339-2
from GS Polymers, Inc.

Two part, 4:1 thermal conductivity, higher visc., chemical & thermal res. [See More]

  • Features: Thermal Insulation; Filled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates; Wide Range of Substrates
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: OEM or Industrial
INSULCAST 116 FR Room Temperature Cure, Equal Ratio Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Features: Encapsulant, Potting Compound; Filled
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Plastic
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
  • Substrate Compatibility: Metal
  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's