FTLV with HARDENER Casting System Kit -- 90-004074
from Ellsworth Adhesives

Sold as a case (4 Kits/case). OXY-CAST 6850 FTLV with HARDENER XL is a low viscosity, versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. Gallon kit. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Electrically Insulative and Thermally Conductive Epoxy -- TD1001
from Epoxy Technology

Product Description: EPO-TEK ® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. EPO-TEK ® TD1001 Advantages & Application Notes: Low Tg, several weeks of pot-life and low modulus are a few... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics; Photonics; Semiconductors, IC's
Haprez™ 3742 General Purpose Epoxy Laminating Binder System -- 3742
from Hapco, Inc.

An economical, general purpose, epoxy laminating and binder system. A clear amber, general purpose system that can be used with a variety of fillers for virtually all room temperature casting and laminating applications. As a laminating system, the extremely low viscosity of HAPREZ ™ 3742... [See More]

  • Features: Encapsulant, Potting Compound; Laminaes
  • Type / Form: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Tooling
Flexible Epoxy Features High Shear and Peel Strength -- EP40
from Master Bond, Inc.

Master Bond Polymer System EP40 is newly developed two component highly flexible epoxy compound for high performance bonding, potting, encapsulation, and sealing with outstanding shear and peel strength. It features excellent adhesion to engineering plastics as well as metals and various other... [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Unfilled
  • Substrate Compatibility: Metal; Plastic; Porous Surfaces
  • Cure / Technology: Two Component  
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Sanitary; OEM or Industrial; Semiconductors, IC's
Loctite(R) 3140(TM) Hysol(R) Epoxy Resin, General Purpose; 1GA -- 079340-39944
from R. S. Hughes Company, Inc.

Loctite(R) 3140(TM) Hysol(R) Epoxy Resin, General Purpose; 1GA. Loctite(R) 3140(TM) Hysol(R) Epoxy Resin, General Purpose is one part of a two part epoxy system to be used with a variety of Loctite(R) Hysol(R) hardeners, formulated for general purpose potting and encapsulating applications. [See More]

  • Features: Encapsulant, Potting Compound
Adhesive; Epoxy Potting Compound; Black -- 70113956 [DP-270-BLACK from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]

  • Features: Encapsulant, Potting Compound
  • Type / Form: Liquid
Aremco-Bond™ Epoxy -- 2150
from Aremco Products, Inc.

Ceramic-filled, fast-setting, high vibration resistance and bond strength [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Filled
  • Industry: Electronics; OEM or Industrial
  • Cure / Technology: Thermoset
  • Use Temperature: 400
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Features: Encapsulant, Potting Compound
  • Type / Form: Liquid
  • Cure / Technology: UV or Radiation Cured
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Features: Encapsulant, Potting Compound; Unfilled
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Electronics
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Features: Encapsulant, Potting Compound; Unfilled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: OEM or Industrial
Circuit Board Protection -- ES6010
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Features: Encapsulant, Potting Compound; Flame Retardant; UL Rating; Filled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset
  • Industry: Electronics
Tuffbond™ -- 305
from Hernon Manufacturing, Inc.

Tuffbond „ ¢ epoxies offer substantial moisture, chemical, and heat resistance. Use for bonding: wood, metal, ceramic, glass, plastic, masonry, stone, concrete, rubber, etc. Provides high shear strength for tough and durable bonds. Surfaces to be bonded must be clean and free of oil. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Non-corrosive; Phase Change; Sealant; Unfilled
  • Type / Form: Gel
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
Epoxy Adhesive -- ANE-46505
from Protavic America, Inc.

Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]

  • Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Unfilled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer