from Allied Electronics, Inc.
Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Andover Corporation
Fuller Epolite FH-5313 is a 100% solid, room temperature curing, electrical grade, epoxy adhesive that has proven to be an excellent bonding agent for ferrite pot cures. This system is designed for continuous operation at temperatures up to 200 °F and is available in premeasured kits. USES. [See More]
- Features: Encapsulant, Potting Compound
- Industry: Optical; Photonics
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Use Temperature: 200
from Ellsworth Adhesives
Sold as a case (4 Kits/case). OXY-CAST 6850 FTLV with HARDENER XL is a low viscosity, versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. Gallon kit. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Type / Form: Liquid
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Epoxy Technology
EPO-TEK ® EP110-R1 is a silver-filled epoxy which is similar to EPO-TEK ® E4110, designed for potting and casting applications. [See More]
- Features: Electrically Conductive; Encapsulant, Potting Compound; Filled
- Substrate Compatibility: Metal; Plastic
- Cure / Technology: Thermoset; Two Component
- Industry: Electronics
from Hapco, Inc.
An economical, general purpose, epoxy laminating and binder system. A clear amber, general purpose system that can be used with a variety of fillers for virtually all room temperature casting and laminating applications. As a laminating system, the extremely low viscosity of HAPREZ ™ 3742... [See More]
- Features: Encapsulant, Potting Compound; Laminaes
- Type / Form: Liquid
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Tooling
from ITW Polymer Technologies - Insulcast Division
INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]
- Features: Encapsulant, Potting Compound; Filled
- Type / Form: Gel
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Plastic
from Master Bond, Inc.
Master Bond Polymer System EP40 is newly developed two component highly flexible epoxy compound for high performance bonding, potting, encapsulation, and sealing with outstanding shear and peel strength. It features excellent adhesion to engineering plastics as well as metals and various other... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Unfilled
- Substrate Compatibility: Metal; Plastic; Porous Surfaces
- Cure / Technology: Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Sanitary; OEM or Industrial; Semiconductors, IC's
from R. S. Hughes Company, Inc.
Loctite(R) 3140(TM) Hysol(R) Epoxy Resin, General Purpose; 1GA. Loctite(R) 3140(TM) Hysol(R) Epoxy Resin, General Purpose is one part of a two part epoxy system to be used with a variety of Loctite(R) Hysol(R) hardeners, formulated for general purpose potting and encapsulating applications. [See More]
- Features: Encapsulant, Potting Compound
from Electro-Lite Corporation
ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
from GS Polymers, Inc.
Two part, general purpose potting compound and adhesive [See More]
- Features: Encapsulant, Potting Compound; Unfilled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: OEM or Industrial
from Henkel Corporation - Electronics
Superior environmental protection, extreme thermal cycling resistance [See More]
- Features: Encapsulant, Potting Compound; Flame Retardant; UL Rating; Filled
- Type / Form: Liquid
- Cure / Technology: Thermoset
- Industry: Electronics
from Protavic America, Inc.
Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer
