5-Minute® Epoxy -- 14250 [14250 from ITW Devcon]
from Applied Industrial Technologies

25 ml dev-tube ™, a rapid-curing, general purpose adhesive/encapsulant [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Wood
  • Type / Form: Liquid
  • Features: Unfilled
BETAMATE™ 1021 One-Part, High Performance, Heat Curing, Fracture-Toughened Epoxy Adhesive
from Dow Automotive Systems

BETAMATE 1021 is a one-part, high performance, heat curing, fracture-toughened epoxy adhesive. It is capable of bonding oily galvanized steel and cold rolled steel and provides excellent long term durability. It also has good impact-peel strength as measured by ISO 11343. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Unfilled
  • Substrate Compatibility: Metal
  • Industry: Automotive
AIRSTONE™ Adhesive System
from Dow Polyurethanes

The AIRSTONE ™ Adhesive System consists of an epoxy resin and two epoxy hardeners with different pot lives. This solvent free, highly thixotropic adhesive has been optimized to meet the stringent requirements of composite wind turbine manufacturing. Applications. This AIRSTONE Adhesive System... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Features: Laminaes
  • Type / Form: Liquid
  • Industry: Electric Power
Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
  • Type / Form: Liquid
  • Features: High Dielectric; UL Rating; Unfilled
Emerson & Cuming ECCOBOND 104 Epoxy Adhesive Black 10oz Can -- 104 PTA BLK 10 OZ
from Ellsworth Adhesives

ECCOBOND 104 is a two component, heat cured, epoxy adhesive with a long pot life; it has excellent chemical resistance and a high shear strength. 10 oz Quart. Required Catalyst [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Industry: OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Use Temperature: -13 to 482
Electrical -- 377H
from Epoxy Technology

EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Type / Form: Liquid
  • Features: Electrically Conductive; EMI/RFI Shielding; Filled
INSULBOND 5-171-1 Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Features: Flexible
  • Type / Form: Liquid
  • Industry: Electronics; OEM or Industrial
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics; Electric Power; Military
  • Features: High Dielectric; Sealant; Unfilled
  • Use Temperature: -60 to 450
Scotch-Weld Adhesive 1386 -- 1386 [1386 from 3M]
from R. S. Hughes Company, Inc.

Very clear, fast setting, room temperature curing, two-part adhesive [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Type / Form: Gel
  • Features: UL Rating; Unfilled
3M™ Scotch-Weld™ Adhesive And Sealant Kit -- 3537
from 3M Aerospace and Aircraft Maintenance Division

Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Aerospace; OEM or Industrial
  • Features: Sealant; Flexible
5 Minute® Adhesive Epoxy -- 14250 [14250 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Wood
  • Type / Form: Liquid
  • Features: Unfilled
Ready-Stick™ Epoxy Putty
from Anti-Seize Technology

Can be tapped drilled and painted, steel hard in 20 minutes [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Filled (optional feature); Unfilled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Wood
  • Industry: Marine; Construction
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Cure / Technology: Thermoset
  • Features: Electrically Conductive; Thermally Conductive; Filled
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Industry: Electronics; OEM or Industrial
Hardman<reg> Epoxy and Urethane Ad -- GO-08778-02
from Cole-Parmer

Epoxy,quick-set, 10/pk. Complete selection of epoxies for all your maintenance needs. Single-use adhesives are perfect for quick repair jobs. Applications: Wood, metal, glass, stone, concrete, and leather. Model: 4001-BG10. Manufacturer number: 4001-BG10. Temperature range (*F): -20 to 180 &176;F. [See More]

  • Cure / Technology: Thermoset
  • Use Temperature: -20 to 180
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood; Leather
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Type / Form: Liquid
  • Features: High Dielectric; Unfilled
EPO-TEK Epoxy -- 353ND
from Fiber Instrument Sales, Inc./FIS

Epoxy remains liquid until heat is applied [See More]

  • Cure / Technology: Thermoset
  • Industry: Fiber Optic Connections
  • Type / Form: Liquid
MAGNOBOND 6398
from Glotrax Polymers Inc.

Magnobond 6398, Parts A & B is a two component thixotropic paste epoxy system designed for bonding metals and composite structures. Magnobond 6398 has good properties at high and low temperatures using a room temperature cure. Applications include insertion filling, composite repair manfacture, and... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Features: Unfilled
  • Substrate Compatibility: Composites; Metal
  • Industry: Aerospace; Automotive
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: Encapsulant, Potting Compound; Unfilled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
  • Industry: OEM or Industrial
Chipbonder® Surface Mount Adhesive -- 3607
from Henkel Corporation - Electronics

Designed for high speed printing and dispensing [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Thermal Insulation; Filled
  • Type / Form: Gel
  • Industry: Electronics
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled
Epoxy Adhesive -- E103
from Koford Engineering, LLC

E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Use Temperature: 257 to 356
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
  • Substrate Compatibility: Metal
  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's