from Applied Industrial Technologies
25 ml dev-tube ™, a rapid-curing, general purpose adhesive/encapsulant [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Wood
- Type / Form: Liquid
- Features: Unfilled
from Dow Automotive Systems
BETAMATE 1021 is a one-part, high performance, heat curing, fracture-toughened epoxy adhesive. It is capable of bonding oily galvanized steel and cold rolled steel and provides excellent long term durability. It also has good impact-peel strength as measured by ISO 11343. [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Unfilled
- Substrate Compatibility: Metal
- Industry: Automotive
from ELANTAS PDG, Inc.
Trickle resin system for impregnation or protective overcoat [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
- Type / Form: Liquid
- Features: High Dielectric; UL Rating; Unfilled
from Ellsworth Adhesives
ECCOBOND 104 is a two component, heat cured, epoxy adhesive with a long pot life; it has excellent chemical resistance and a high shear strength. 10 oz Quart. Required Catalyst [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: OEM or Industrial
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Use Temperature: -13 to 482
from Epoxy Technology
EPO-TEK ® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Metal; Plastic
- Type / Form: Liquid
- Features: EMI/RFI Shielding; Filled
from ITW Polymer Technologies - Insulcast Division
INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Flexible
- Type / Form: Liquid
- Industry: Electronics; OEM or Industrial
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Cure / Technology: Thermoset; Single Component
- Industry: Electronics; Electric Power; Military
- Features: High Dielectric; Sealant; Unfilled
- Use Temperature: -60 to 450
from R. S. Hughes Company, Inc.
Very clear, fast setting, room temperature curing, two-part adhesive [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
- Type / Form: Gel
- Features: UL Rating; Unfilled
from Anti-Seize Technology
Can be tapped drilled and painted, steel hard in 20 minutes [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Filled (optional feature); Unfilled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Wood
- Industry: Marine; Construction
from Cole-Parmer
Epoxy,quick-set, 10/pk. Complete selection of epoxies for all your maintenance needs. Single-use adhesives are perfect for quick repair jobs. Applications: Wood, metal, glass, stone, concrete, and leather. Model: 4001-BG10. Manufacturer number: 4001-BG10. Temperature range (*F): -20 to 180 &176;F. [See More]
- Cure / Technology: Thermoset
- Use Temperature: -20 to 180
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood; Leather
from Fiber Instrument Sales, Inc./FIS
Epoxy remains liquid until heat is applied [See More]
- Cure / Technology: Thermoset
- Industry: Fiber Optic Connections
- Type / Form: Liquid
from Fibro, Inc.
Mixing ratio 2:1, two-component tin [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Metal
- Type / Form: Liquid
- Viscosity: 1000
from Glotrax Polymers Inc.
Magnobond 6398, Parts A & B is a two component thixotropic paste epoxy system designed for bonding metals and composite structures. Magnobond 6398 has good properties at high and low temperatures using a room temperature cure. Applications include insertion filling, composite repair manfacture, and... [See More]
- Cure / Technology: Thermoset; Two Component
- Features: Unfilled
- Substrate Compatibility: Composites; Metal
- Industry: Aerospace; Automotive
from GS Polymers, Inc.
Two part, general purpose potting compound and adhesive [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: Encapsulant, Potting Compound; Unfilled
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
- Industry: OEM or Industrial
from Henkel Corporation - Electronics
Designed for high speed printing and dispensing [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Thermal Insulation; Filled
- Type / Form: Gel
- Industry: Electronics
from Koford Engineering, LLC
E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]
- Cure / Technology: Thermoset; Single Component
- Use Temperature: 257 to 356
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]
- Cure / Technology: Thermoset; Single Component
- Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
- Substrate Compatibility: Metal
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
