Thermosetting / Crosslinking Epoxy Adhesives Datasheets

5-Minute® Epoxy -- 14250 [14250 from ITW Devcon]
from Applied Industrial Technologies

25 ml dev-tube ™, a rapid-curing, general purpose adhesive/encapsulant [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Wood
  • Type / Form: Liquid
  • Features: Unfilled
Epoxylite® -- E 230 - C 230
from ELANTAS PDG, Inc.

Trickle resin system for impregnation or protective overcoat [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Metal; Paper or Paperboard; Plastic; Dissimilar Substrates
  • Type / Form: Liquid
  • Features: High Dielectric; UL Rating; Unfilled
Electrically and Thermally Conductive Adhesive -- EPO-TEK® EK1000
from Epoxy Technology

A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Electrically Conductive; Thermally Conductive; Filled
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Industry: Electronics; Semiconductors, IC's
Custom Epoxy Resin
from Gabriel Performance Products, LLC

Specialty Chemicals. Specialized Focus. Specialty chemicals are what we do and who we are, which has made us a leader in performing complex organic synthesis to provide the highest quality products to meet your exacting custom manufacturing requirements. Need to scale up from lab to pilot to larger... [See More]

  • Cure / Technology: Thermoset
  • Industry: Aerospace; Automotive; Sanitary; Petrochemical, Personal Care, Chemical
Key #510-CV Cove Base Paste
from Key Resin Company

KEY RESIN #510-CV is a multi-purpose paste consistency epoxy binder used for various KEY COVE BASE SYSTEMS, and as a general purpose spackle or filler compound. This all purpose epoxy resin has excellent thixotropic properties compared to other epoxy formulations, making it ideal for use on vertical... [See More]

  • Cure / Technology: Thermoset
  • Tensile (Break): 8500
  • Industry: OEM or Industrial
  • Elongation: 5.5
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22
from Master Bond, Inc.

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Laminaes; Sealant; Anti-static, ESD; Flexible; Filled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
Scotch-Weld Adhesive 1386 -- 1386 [1386 from 3M]
from R. S. Hughes Company, Inc.

Very clear, fast setting, room temperature curing, two-part adhesive [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Type / Form: Gel
  • Features: UL Rating; Unfilled
3M™ Scotch-Weld™ Adhesive And Sealant Kit -- 3537
from 3M Aerospace and Aircraft Maintenance Division

Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Aerospace; OEM or Industrial
  • Features: Sealant; Flexible
5 Minute® Adhesive Epoxy -- 14250 [14250 from ITW Devcon]
from All-Spec Industries

" This item can not be exported outside the United States" [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Porous Surfaces; Wood
  • Type / Form: Liquid
  • Features: Unfilled
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Cure / Technology: Thermoset
  • Features: Electrically Conductive; Thermally Conductive; Filled
  • Substrate Compatibility: Ceramic, Glass; Metal
  • Industry: Electronics; OEM or Industrial
5 Minute Set Epoxy -- 10-3005
from Epoxies Etc...

These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Dissimilar Substrates
  • Type / Form: Liquid
  • Features: High Dielectric; Unfilled
EPO-TEK Epoxy -- 353ND
from Fiber Instrument Sales, Inc./FIS

Epoxy remains liquid until heat is applied [See More]

  • Cure / Technology: Thermoset
  • Industry: Fiber Optic Connections
  • Type / Form: Liquid
MAGNOBOND 6398
from Glotrax Polymers Inc.

Magnobond 6398, Parts A & B is a two component thixotropic paste epoxy system designed for bonding metals and composite structures. Magnobond 6398 has good properties at high and low temperatures using a room temperature cure. Applications include insertion filling, composite repair manfacture, and... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Features: Unfilled
  • Substrate Compatibility: Composites; Metal
  • Industry: Aerospace; Automotive
GSP 1329
from GS Polymers, Inc.

Two part, general purpose potting compound and adhesive [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Features: Encapsulant, Potting Compound; Unfilled
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates
  • Industry: OEM or Industrial
Conebonder -- 394
from Hernon Manufacturing, Inc.

Hernon ® Conebonder adhesives are designed for the voice coil to cone bond on audio speakers. The heat-cure Conebonder adhesives overcome the obstacles associated with using two-component adhesives in production applications including mixing ratio, cure speed, and potential solidification in... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
  • Features: High Dielectric; Laminaes; Non-corrosive; Phase Change; Sealant; Thermal Insulation; Unfilled
INSULBOND 5-171-1 Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 5-171-1 is a clear, flowable epoxy resin adhesive designed for applications that require a high degree of peel strength, flexibility, and ability to bond to varied substrates. Curable at room temperature or mild oven temperatures, INSULBOND 5-171-1 retains its flexibility over a very broad... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Features: Flexible
  • Type / Form: Liquid
  • Industry: Electronics; OEM or Industrial
Epoxy Adhesive -- E103
from Koford Engineering, LLC

E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Use Temperature: 257 to 356
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Features: Electrically Conductive; Thermally Conductive; Flexible; Filled
  • Substrate Compatibility: Metal
  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's