Semiconductors / IC Packaging Hot Melt Adhesives Datasheets
from Master Bond, Inc.
Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Construction; Semiconductors, IC's; Tooling; Chemical/Oil Processing, Metal Working
- Type / Form: Liquid
- Cure / Technology: Thermoplastic / Hot Melt; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates