Semiconductors / IC Packaging Hot Melt Adhesives Datasheets
from Master Bond, Inc.
Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Optical; Construction; Semiconductors, IC's; Tooling; Chemical/Oil Processing, Metal Working
- Type / Form: Liquid
- Cure / Technology: Thermoplastic / Hot Melt; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates