from 3M Industrial Adhesives & Tapes Canada
3M ™ Scotch-Weld ™ Hot Melt Adhesive 3792 LM B is a low-melt with long bonding range adhesive. Clear/multi-purpose. Low temperature applied. 100 percent solids. Woodworking, furniture, automotive, transportation, aerospace, general industrial, upholstery, point of purchase display,... [See More]
- Substrate Compatibility: Paper or Paperboard; Plastic; Wood; Foam
- Type / Form: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
- Industry: Electronics; Military; Construction; OEM or Industrial
from Ellsworth Adhesives
Bostik Thermogrip 2107 is a tough, medium setting, versatile hot melt adhesive, good "idling" performance in most glue applicators, low odor. 7/16 x 10" sticks. Available Applicator Sold by the case (25 LB/case). [See More]
- Substrate Compatibility: Plastic; Porous Surfaces; Furniture
- Type / Form: Gel; Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Industry: Furniture
from Sheldahl - A Multek Brand
PRODUCT DESCRIPTION. Sheldahl Polyurethane Adhesive is designed to be used in conjunction with an isocyanate curing agent as a two-component system. These systems produce a tough, flexible, temperature and chemical resistant bond. APPLICATIONS. Sheldahl Adhesives are specifically designed for... [See More]
- Substrate Compatibility: Paper or Paperboard; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Splicing Abrasive Belts
- Cure / Technology: Thermoplastic / Hot Melt; Two Component
- Chemical System: Polyurethane
- Type / Form: Liquid
from Cattie Adhesive Solutions
Permanent Hot melt adhesives are 100% solids formulations based on thermoplastic polymers. They are solid at room temperature and are activated upon heating above their softening point, at which stage they are liquid, and can be applied. After application, they retain the ability to wet-out the... [See More]
- Substrate Compatibility: Plastic; Wood; Film, Foil
- Cure / Technology: Thermoplastic / Hot Melt
- Chemical System: Polyethylene
- Type / Form: Pellets
from Henkel Corporation - Electronics
Ease-of-use, thermal conductivity [See More]
- Substrate Compatibility: Metal; Tin-Lead, Silver_Palladium
- Cure / Technology: Thermoplastic / Hot Melt; Thermoset
- Composition: Filled
- Type / Form: Liquid
