Bostik Thermogrip 2107 Hot Melt Adhesive 7/16in X 10in -- HM2107-F10
from Ellsworth Adhesives

Bostik Thermogrip 2107 is a tough, medium setting, versatile hot melt adhesive, good "idling" performance in most glue applicators, low odor. 7/16 x 10" sticks. Available Applicator Sold by the case (25 LB/case). [See More]

  • Substrate Compatibility: Plastic; Porous Surfaces; Furniture
  • Type / Form: Gel; Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Industry: Furniture
Sheldahl Abrasive Belt Adhesive -- A455-15
from Sheldahl - A Multek Brand

PRODUCT DESCRIPTION. Sheldahl Polyurethane Adhesive is designed to be used in conjunction with an isocyanate curing agent as a two-component system. These systems produce a tough, flexible, temperature and chemical resistant bond. APPLICATIONS. Sheldahl Adhesives are specifically designed for... [See More]

  • Substrate Compatibility: Paper or Paperboard; Plastic; Rubber or Elastomer; Textiles or Fabrics; Wood; Splicing Abrasive Belts
  • Cure / Technology: Thermoplastic / Hot Melt; Two Component  
  • Chemical System: Polyurethane
  • Type / Form: Liquid
General Purpose Glue Stick -- GF232 [GF232 from STEINEL]
from All-Spec Industries

The Steinel 04031 are high quality general purpose clear glue sticks for industrial and high volume use. These come 15 per pack. [See More]

  • Substrate Compatibility: General Purpose
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Chemical System: Gum
  • Type / Form: Pellets
Permanent Hot Melt Adhesive -- W201
from Cattie Adhesive Solutions

Permanent Hot melt adhesives are 100% solids formulations based on thermoplastic polymers. They are solid at room temperature and are activated upon heating above their softening point, at which stage they are liquid, and can be applied. After application, they retain the ability to wet-out the... [See More]

  • Substrate Compatibility: Plastic; Wood; Film, Foil
  • Cure / Technology: Thermoplastic / Hot Melt
  • Chemical System: Polyethylene
  • Type / Form: Pellets
Thermal Management Adhesive -- QMI 5030
from Henkel Corporation - Electronics

Ease-of-use, thermal conductivity [See More]

  • Substrate Compatibility: Metal; Tin-Lead, Silver_Palladium
  • Cure / Technology: Thermoplastic / Hot Melt; Thermoset
  • Composition: Filled
  • Type / Form: Liquid