EMI / RFI Shielding Material Hot Melt Adhesives Datasheets
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30R is a fiber reinforced, high viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does... [See More]
- Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Type / Form: Liquid
- Cure / Technology: Thermoplastic / Hot Melt; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates