Thermoplastic / Hot Melt Polysulphide Adhesives and Sealants Datasheets
from Master Bond, Inc.
Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a five (5) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Composites; Plastic; Porous Surfaces; Dissimilar Substrates
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Semiconductors, IC's; Chemical/Oil Processing/Metal Working
- Use Temperature: -65 to 200