from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Features: High Dielectric; Filled; Flame Retardant; Flexible; Non-corrosive
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Substrate Compatibility: Dissimilar Substrates
from Bayer MaterialScience LLC
PT1700S is a specially formulated aromatic polyether based film for applications requiring high moisture vapor transmission. PT1700S maintains mechanical properties essentially equivalent to a conventional polyether TPU, yet this material allows water vapor to pass through it at a rate of 3 to 5... [See More]
- Features: Anti-static, ESD; Flame Retardant; Laminaes
- Tensile (Break): 5300
- Compound Type: Sealant
- Elongation: 600.0
from Henkel Corporation - Electronics
Superior environmental protection, extreme thermal cycling resistance [See More]
- Features: Filled; Flame Retardant; UL Rating
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Sealant
- Cure / Technology: Single Component; Thermoset
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Features: High Dielectric; Filled; Flame Retardant; Flexible; Thermal Insulation; UL Rating
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic