Flame Retardant (e.g. UL 94 Rated) Polyurethane Adhesives and Sealants Datasheets

ELAN-Tron® -- U 6752 FR White Resin / UH 510S Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Features: High Dielectric; Filled; Flame Retardant; Flexible; Non-corrosive
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound
  • Substrate Compatibility: Dissimilar Substrates
Flame retardant thermally conductive polyurethane -- 50-2150FR
from Epoxies Etc...

The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. 50-2150 is a two part, non-mercury, flexible polyurethane potting system. [See More]

  • Features: High Dielectric; Flame Retardant; Flexible
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Thermoset; Two Component  
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Industry: Electronics
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Features: High Dielectric; Filled; Flame Retardant; Flexible; Thermal Insulation; UL Rating
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic