Semiconductors / IC Packaging Polyurethane Adhesives and Sealants Datasheets

Acrylic Polymer Based, Pressure Sensitive Hot Melt -- MB528
from Master Bond, Inc.

Master Bond Polymer System MB528 is a high performance 100% solid acrylic resin based hot melt compound designed for use as a hot melt pressure sensitive adhesive. It exhibits good adhesion to a wide variety of materials including polyester, glass, aluminum, steel, fabric and paper. Master Bond... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Liquid
  • Compound Type: Leveling Filling; Adhesive
  • Substrate Compatibility: Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Fast Gelling Polyurethane Compound -- 50-2370
from Epoxies Etc...

50-2370 is a new thermally conductive polyurethane potting compound. This system is designed for low stress on sensitive components during and after cure. It is formulated for applications requiring low exotherm, low shrinkage, excellent electrical properties and a rapid 5 minute gel time. [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's; Surface Mount Components
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Substrate Compatibility: Composites; Metal; Plastic
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic