Semiconductors / IC Packaging Polyurethane Adhesives and Sealants Datasheets

Biocompatible One Component LED Curable System -- LED403Med
from Master Bond, Inc.

Master Bond LED403Med is a very special, one part LED curable system that can be used as an adhesive, sealant, coating and encapsulation system. It requires no mixing and has excellent dimensional stability, electrical insulation and chemical resistance. LED403Med withstands sterilization, including... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Military (optional feature); Optical; Photonics; Construction (optional feature); OEM or Industrial; Semiconductors, IC's; Tooling
  • Type / Form: Gel (optional feature); Liquid (optional feature); Pellets (optional feature); Powder (optional feature)
  • Compound Type: Encapsulant, Potting Compound; Leveling Filling (optional feature); Sealant; Thermally Conductive (optional feature); Threadlocker or Retainer (optional feature); Adhesive
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites; Metal; Paper or Paperboard (optional feature); Plastic; Porous Surfaces; Rubber or Elastomer; Textiles or Fabrics (optional feature); Wood (optional feature); Dissimilar Substrates
Fast Gelling Polyurethane Compound -- 50-2370
from Epoxies Etc...

50-2370 is a new thermally conductive polyurethane potting compound. This system is designed for low stress on sensitive components during and after cure. It is formulated for applications requiring low exotherm, low shrinkage, excellent electrical properties and a rapid 5 minute gel time. [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's; Surface Mount Components
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Substrate Compatibility: Composites; Metal; Plastic
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic