Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
  • Features: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding; Filled; Flexible; Laminaes
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Compound Type: Thermally Conductive; Adhesive
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Two Component  
  • Substrate Compatibility: Metal; Plastic
  • Features: Flexible
Circuit Board Protection -- US5520
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Substrate Compatibility: Plastic
  • Type / Form: Liquid
  • Cure / Technology: Single Component; Thermoset
HASA -- 716
from Hernon Manufacturing, Inc.

HERNON ® offers a complete line of structural anaerobics, the HASA line of products. These adhesives are 100% active single component adhesives that cure upon exclusion of air. HASA adhesive have been highly engineered to meet specific design criteria combing high tensile, impact, temperature,... [See More]

  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Dissimilar Substrates
  • Type / Form: Liquid
  • Cure / Technology: Room Temperature Vulcanizing or Curing; Single Component; Thermoset