from Device Technologies, Inc.
The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]
- Features: Filled; Flexible; Flame Retardant; Non-corrosive
- Substrate Compatibility: Metal
- Chemical System: Silicone
- Type / Form: Sheet or Film; Gel