Thermal Interface Materials -- DTIM Series
from Device Technologies, Inc.

The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]

  • Features: Filled; Flexible; Flame Retardant; Non-corrosive
  • Substrate Compatibility: Metal
  • Chemical System: Silicone
  • Type / Form: Sheet or Film; Gel
Sil-Pad® 1100ST [Sil-Pad® 1100ST from Bergquist Company (The)]
from Quist Electronics

Inherent tack on both sides for exceptional thermal performance [See More]

  • Features: Filled; Flame Retardant; UL Rating
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
  • Chemical System: Elastomeric
  • Type / Form: Sheet or Film
3M™ Thermally Conductive Tape -- 8805
from 3M Electronics Design & Manufacturing

3M ™ Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). • These tapes are tacky pressure... [See More]

  • Features: Filled; UL Rating
  • Substrate Compatibility: Metal
  • Chemical System: Acrylic
  • Type / Form: Sheet or Film
Poly-Temp® Anti-Seize Tapes
from Anti-Seize Technology

Discourages seizing, galling and carbon fusing, non-flammable, non-staining [See More]

  • Features: Filled
  • Industry: OEM or Industrial
  • Substrate Compatibility: Metal; Plastic
  • Use Temperature: -450 to 1800