from Master Bond, Inc.
Master Bond UV10FL-1 and UV10FLTK-1 are a one component UV curable modified compounds, ready for use as supplied, for high performance casting and bonding applications. UV10FL-1 is a low viscosity liquid at room temperature and UV10FLTK-1 is a medium viscosity liquid at room temperature. When... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Laminaes; Leveling Filling; Non-corrosive; Sealant; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
from Quist Electronics
Tough dielectric barrier, designed to replace ceramic insulators [See More]
- Features: High Dielectric; Flame Retardant; Thermally Conductive; UL Rating
- Composition: Filled
- Chemical System: Silicone; Kapton®
- Cure / Technology: Contact or Pressure Sensitive Adhesives (optional feature)
from Wacker Chemical Corp.
SEMICOSIL ® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features. Rapid UV acceleration. Shadow cure. solvent free. Application. SEMICOSIL ® 936 UV is intended as a protective coating... [See More]
- Features: High Dielectric
- Cure / Technology: Thermoset; UV or Radiation Cured (optional feature); Single Component; Reactive or Moisture Cured (optional feature); Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type / Form: Liquid
from Novagard Solutions
Non-corrosive, single component silicone coating & encapsulating compound [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Sealant
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
