from Applied Industrial Technologies
Cures to a tough, flexible rubber; makes gaskets that resist shrinking [See More]
- Features: Flexible
- Composition: Unfilled
- Compound Type: Sealant
- Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
from Device Technologies, Inc.
The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]
- Features: Flexible; Flame Retardant; Non-corrosive
- Type / Form: Gel
- Compound Type: Thermally Conductive; Adhesive
- Substrate Compatibility: Metal
from ITW Polymer Technologies - Insulcast Division
INSULCAST RTVS A-4000 is a two component solvent based silicone resin adhesive with excellent lap shear and peel strengths at elevated temperatures. RTVS A-4000 can be used to bond silicones, mylar, metals and many engineering plastics, and will maintain significant peel strength up to 300 °F. [See More]
- Features: Flexible
- Type / Form: Liquid
- Compound Type: Adhesive
- Substrate Compatibility: Metal; Plastic; Rubber or Elastomer
from Master Bond, Inc.
Master Bond Master Sil 701 is a ready-to-use, one component, high performance silicone elastomer compound for bonding, and sealing protective coatings and formed-in-place gaskets. This compound has a paste consistency and will not sag, slump or run off surfaces. It cures at ambient temperatures to a... [See More]
- Features: Flexible; High Dielectric
- Substrate Compatibility: Metal; Plastic
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Quist Electronics
Enhanced puncture, shear and tear resistance, electrically isolating [See More]
- Features: Flexible; Electrically Conductive; Flame Retardant
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
- Compound Type: Leveling Filling; Thermally Conductive
- Composition: Filled
from Wacker Chemical Corp.
ELASTOSIL ® N199 is a non-slump RTV-1 silicone sealant that cures at room temperature on contact with moisture in the air. Special features. ready-to-use, one-part system. non-slump. translucent. medium hardness. high flexibility. excellent adhesion. Application. general-purpose adhesive for the... [See More]
- Features: Flexible
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Compound Type: Sealant; Adhesive
- Industry: Electronics
from Glotrax Polymers Inc.
A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]
- Features: Flexible; High Dielectric; Non-corrosive; UL Rating
- Type / Form: Gel
- Compound Type: Encapsulant, Potting Compound; Sealant
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
from Novagard Solutions
Single component, moisture cured silicone rubber, strong durable sealant [See More]
- Features: Flexible
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Aluminum; Fiberglass
- Compound Type: Sealant
- Composition: Unfilled
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Features: Flexible; Electrically Conductive
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
