UL Approved Silicone Adhesives and Sealants Datasheets

587™ Blue High Performance RTV Silicone Gasket Maker -- 40462 [40462 from Henkel Corporation - Industrial]
from Applied Industrial Technologies

190 mL Aersol; Forms Tough, Flexible Gaskets Directly On the Flange; Excellent Adhesion to Oily Surfaces; Low Odor; Non-Corrosive; Use in Temps to 500 °F; Resistant to Most Chemicals and Solvents [See More]

  • Features: UL Rating
  • Substrate Compatibility: Oily Surfaces
  • Compound Type: Sealant
  • Cure / Technology: Single Component
Thermally Conductive Flame Retardant Silicone -- MasterSil 156
from Master Bond, Inc.

Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]

  • Features: High Dielectric; Flame Retardant; Non-corrosive; UL Rating
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Fire Barrier 2000+ Silicone Sealant
from R. S. Hughes Company, Inc.

ASTM E 814, fire rated up to 4 hours, 24" maximum pipe size [See More]

  • Features: Thermal Insulation; UL Rating
  • Composition: Unfilled
  • Compound Type: Sealant
  • Cure / Technology: Thermoset
Chemical,Silicone Conformal Coating,10 Oz,Aerosol Can -- 70206148
from Allied Electronics, Inc.

Relaxed Retraction Coil Cords, 4 mm Stud Size, Black Color. The silicone coating engineered for maximum flexibility and protection from extreme temperatures and vibration damage. Safe for most plastics. Flammable and ozone safe, CFC/HCFC free. Meets MILI-46058C, Type SR. UL Recognized. Silicone... [See More]

  • Features: UL Rating
  • Use Temperature: -83 to 392
  • Type / Form: Liquid
  • Dielectric Strength: 1100
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Features: Flexible; High Dielectric; Non-corrosive; UL Rating
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
INSULCAST RTVS 200 RTV Silicone Compound
from ITW Polymer Technologies - Insulcast Division

Flexible Epoxy with Superior Thermal Shock Resistance - ITW INSULGEL 70CC FR NS is an epoxy compound which exhibits superior thermal shock resistance. By making use of an inherently flexible epoxy resin and special filler technology, INSULGEL 70 CC FR NS provides reduced shrinkage and low... [See More]

  • Features: Electrically Conductive; Flame Retardant; Non-corrosive; Thermal Insulation; UL Rating
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Silicone Compound -- RTV 400-900
from Novagard Solutions

Non-corrosive, single component silicone compound, non-flowable [See More]

  • Features: High Dielectric; Non-corrosive; UL Rating
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Compound Type: Sealant
  • Composition: Unfilled
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Features: Flexible; Electrically Conductive; Flame Retardant; UL Rating
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
  • Substrate Compatibility: Metal