Electrical Power / HV Silicone Adhesives and Sealants Datasheets

Flexible,Fast Curing Silicone for Medical Device Assemblies -- MasterSil 910Med
from Master Bond, Inc.

Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Composition: Unfilled
RTV-2 Silicone Gel -- SILGEL® 613 w/ CAT PT
from Wacker Chemical Corp.

WACKER SilGel ® 613 is a pourable, addition-curing, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 10 : 1 mixing ratio. very low viscosity. rapid curing at room temperature with ELASTOSIL ® CAT PT-F. very low hardness... [See More]

  • Industry: Automotive; Electronics; Electric Power; Optical; OEM or Industrial
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Potting, Encapsulant Elastomer -- Bluesil™ Esa 7252 QC A/B
from Bluestar Silicones USA Corp.

Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]

  • Industry: Electronics; Electric Power
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
Silastomers® -- 333
from Hernon Manufacturing, Inc.

HERNON Silastomer ® sealants are high performance, single component, moisture curing RTV (room temperature vulcanizing) silicone gasketing materials that cure into a strong, silicone rubber that maintains long term durability and flexibility. They have a non-slumping, paste-like consistency,... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Composition: Unfilled
RTVS 27 HTC Low Viscosity Thermally Conductive Potting Compound
from ITW Polymer Technologies - Insulcast Division

RTVS 27 HTC is a low viscosity, flame retardant, reversion resistant silicone compound. The low viscosity and high thermal conductivity makes the RTVS 27 HTC ideal for potting dense component packages requiring heat dissipation. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
  • Substrate Compatibility: Plastic
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Metal; Plastic