Molykote® 111 Compound
from Dow Corning Oil & Gas Solutions

Lubrication for control and pressure plug valves, water softener and faucet valves.Sealant for vacuum and pressure systems.Sealant for outdoor equipment (also shipboard) subject to washing and harsh environmental exposure: meters, electrical service entrance and underground connections.Damping... [See More]

  • Industry: Automotive; Electronics; Electric Power; Marine; OEM or Industrial
  • Type / Form: Liquid
  • Compound Type: Sealant; Thermally Conductive
  • Substrate Compatibility: Metal; Rubber or Elastomer
Dow Corning Silicone Elastomer 19.9kg Kit Translucent -- 186 ELAST PLASTIC 19.9KG
from Ellsworth Adhesives

Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer. 19.9 kg pail. Documentation: Dow Corning MSDS/TDS [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial
  • Cure / Technology: Two Component  
  • Compound Type: Encapsulant, Potting Compound
  • Use Temperature: -49 to 392
RTVS 27 HTC Low Viscosity Thermally Conductive Potting Compound
from ITW Polymer Technologies - Insulcast Division

RTVS 27 HTC is a low viscosity, flame retardant, reversion resistant silicone compound. The low viscosity and high thermal conductivity makes the RTVS 27 HTC ideal for potting dense component packages requiring heat dissipation. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Construction; OEM or Industrial; Electronic Encapsulants
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
  • Substrate Compatibility: Plastic
Sil-Pad 1500® [Sil-Pad 1500® from Bergquist Company (The)]
from Quist Electronics

Economical, high performance insulator [See More]

  • Industry: Automotive; Electronics; Electric Power; Semiconductors, IC's
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
  • Compound Type: Leveling Filling; Thermally Conductive
  • Composition: Filled
RTV-2 Silicone Gel -- SILGEL® 613 w/ CAT PT
from Wacker Chemical Corp.

WACKER SilGel ® 613 is a pourable, addition-curing, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 10 : 1 mixing ratio. very low viscosity. rapid curing at room temperature with ELASTOSIL ® CAT PT-F. very low hardness... [See More]

  • Industry: Automotive; Electronics; Electric Power; Optical; OEM or Industrial
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Silastomers® -- 333
from Hernon Manufacturing, Inc.

HERNON Silastomer ® sealants are high performance, single component, moisture curing RTV (room temperature vulcanizing) silicone gasketing materials that cure into a strong, silicone rubber that maintains long term durability and flexibility. They have a non-slumping, paste-like consistency,... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Composition: Unfilled
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Metal; Plastic