from Applied Industrial Technologies
300 mL Cartridge; Forms Tough, Flexible Gaskets Directly On the Flange; Excellent Adhesion to Oily Surfaces; Low Odor; Non-Corrosive; Use in Temps to 500 °F; Resistant to Most Chemicals and Solvents [See More]
- Industry: Aerospace; Automotive; Electronics; Marine; Sanitary; Military; Optical; Photonics; OEM or Industrial
- Cure / Technology: Thermoplastic / Hot Melt; Single Component; Room Temperature Vulcanizing or Curing
- Compound Type: Sealant
- Gap Fill: 0.2500
from Bluestar Silicones USA Corp.
One-Component , Black, Light Opaque, Addition Cure, Electronic Protective coating Silicone Compound. Properties. Viscosity 35000. Hardness Sha 45. Description. Bluesil V-205 is a one component, black, addition cure silicone rubber compound. It is designed as a protective coating for electronic... [See More]
- Industry: Electronics
- Cure / Technology: Single Component
- Type / Form: Liquid
from Device Technologies, Inc.
The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]
- Industry: Aerospace; Electronics; Sanitary; Military; OEM or Industrial; Telecommunications, IT
- Type / Form: Gel
- Compound Type: Thermally Conductive; Adhesive
- Substrate Compatibility: Metal
from Ellsworth Adhesives
One-part, medium viscosity; ozone-safe (VOC exempt) solvent borne, elastoplastic silicone resin; excellent abrasion resistance. Other sizes available. Documentation: Dow Corning MSDS/TDS [See More]
- Industry: Aerospace; Automotive; Electronics; Marine; Sanitary; Military; Photonics; OEM or Industrial
- Cure / Technology: Low VOC
- Compound Type: Sealant
- Viscosity: 1250
from ITW Polymer Technologies - Insulcast Division
INSULCAST 42 is a low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, low moisture absorption and excellent dielectric insulation. INSULCAST 42 bonds well to most metals and plastics. [See More]
- Industry: Electronics; OEM or Industrial
- Substrate Compatibility: Metal; Plastic
- Compound Type: Encapsulant, Potting Compound
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Master Sil 701 is a ready-to-use, one component, high performance silicone elastomer compound for bonding, and sealing protective coatings and formed-in-place gaskets. This compound has a paste consistency and will not sag, slump or run off surfaces. It cures at ambient temperatures to a... [See More]
- Industry: Electronics; Sanitary; Military
- Substrate Compatibility: Metal; Plastic
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Newark / element14
RTV SILICONE SEALANT CLR TUBE 310ML; Sealant Type:Silicone RTV; Sealant Applications:Electronics; Color:Transparent; Dispensing Method:Tube; Series:734; Volume:310ml; Operating Temperature Max:200°C; Operating Temperature Min:-50°C [See More]
- Industry: Electronics
- Compound Type: Sealant
from Quist Electronics
Enhanced puncture, shear and tear resistance, electrically isolating [See More]
- Industry: Electronics; Semiconductors, IC's; Telecommunications, Power Conversion
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
- Compound Type: Leveling Filling; Thermally Conductive
- Composition: Filled
from Wacker Chemical Corp.
ELASTOSIL ® RT 705 f is a flowable, additioon curing, thermally curing, one-component silicone rubber. Special characteristics. Ready-to-use, one-component. Flowable. High extrusion rate. Fast curing at high temperatures. Good heat stability. Excellent primerless adhesion to many substrates. [See More]
- Industry: Electronics
- Cure / Technology: Thermoset; Single Component
- Compound Type: Adhesive
- Viscosity: 20000 to 40000
from 3M Electronics Markets Materials Division
Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. Consists of highly conformable, slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles. [See More]
- Industry: Electronics
- Substrate Compatibility: Metal
- Compound Type: Thermally Conductive; Adhesive
- Cure / Technology: Contact or Pressure Sensitive Adhesives
from Farnell Europe
SEALANT, SILICONE, CLEAR, 310ML [See More]
- Industry: Electronics
- Compound Type: Sealant
from Glotrax Polymers Inc.
A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]
- Industry: Electronics; OEM or Industrial
- Type / Form: Gel
- Compound Type: Encapsulant, Potting Compound; Sealant
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
from Henkel Corporation - Electronics
Superior environmental protection, extreme thermal cycling resistance [See More]
- Industry: Electronics
- Type / Form: Liquid
- Compound Type: Sealant
- Composition: Filled
from Novagard Solutions
Single component, moisture cured silicone rubber, strong durable sealant [See More]
- Industry: Electronics; OEM or Industrial
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Aluminum; Fiberglass
- Compound Type: Sealant
- Composition: Unfilled
from Protavic America, Inc.
PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Substrate Compatibility: Metal; Plastic
from Shin-Etsu Silicones of America
Excellent adhesion to many substrates [See More]
- Industry: Electronics; OEM or Industrial
- Type / Form: Gel
- Compound Type: Sealant; Adhesive
- Cure / Technology: Room Temperature Vulcanizing or Curing
