587 Blue RTV Gasket Maker 300 ml -- 58775 [58775 from Henkel Corporation]
from Applied Industrial Technologies

300 mL Cartridge; Forms Tough, Flexible Gaskets Directly On the Flange; Excellent Adhesion to Oily Surfaces; Low Odor; Non-Corrosive; Use in Temps to 500 °F; Resistant to Most Chemicals and Solvents [See More]

  • Industry: Aerospace; Automotive; Electronics; Marine; Sanitary; Military; Optical; Photonics; OEM or Industrial
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component; Room Temperature Vulcanizing or Curing
  • Compound Type: Sealant
  • Gap Fill: 0.2500
Dow Corning 1-2577 Low VOC Silicone Conformal Coating 408g -- 1-2577 LOW VOC CTG 408G
from Ellsworth Adhesives

One-part, medium viscosity; ozone-safe (VOC exempt) solvent borne, elastoplastic silicone resin; excellent abrasion resistance. Other sizes available. Documentation: Dow Corning MSDS/TDS [See More]

  • Industry: Aerospace; Automotive; Electronics; Marine; Sanitary; Military; Photonics; OEM or Industrial
  • Cure / Technology: Low VOC
  • Compound Type: Sealant
  • Viscosity: 1250
Silicone Transfer Adhesive -- TRANS-SIL NT-1001
from Dielectric Polymers, Inc.

High performance bonding and other application involving harsh environment [See More]

  • Industry: Aerospace; Automotive; Marine; Sanitary; Military; OEM or Industrial
  • Substrate Compatibility: Composites; Metal; Plastic; Dissimilar Substrates
  • Compound Type: Adhesive
  • Composition: Unfilled
Silastomers® -- 333
from Hernon Manufacturing, Inc.

HERNON Silastomer ® sealants are high performance, single component, moisture curing RTV (room temperature vulcanizing) silicone gasketing materials that cure into a strong, silicone rubber that maintains long term durability and flexibility. They have a non-slumping, paste-like consistency,... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Construction; OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Composition: Unfilled