Photonics / Optoelectronics Silicone Adhesives and Sealants Datasheets

587 Blue RTV Gasket Maker 300 ml -- 58775 [58775 from Henkel Corporation - Industrial]
from Applied Industrial Technologies

300 mL Cartridge; Forms Tough, Flexible Gaskets Directly On the Flange; Excellent Adhesion to Oily Surfaces; Low Odor; Non-Corrosive; Use in Temps to 500 °F; Resistant to Most Chemicals and Solvents [See More]

  • Industry: Aerospace; Automotive; Electronics; Marine; Sanitary; Military; Optical; Photonics; OEM or Industrial
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component; Room Temperature Vulcanizing or Curing
  • Compound Type: Sealant
  • Gap Fill: 0.2500
RTV-2 Silicone Rubber -- ELASTOSIL® Solar 3210 A/B
from Wacker Chemical Corp.

ELASTOSIL ® Solar 3210 A/B is a pourable, addition-curing, RTV-2 silicone rubber that vulcanizes at room temperature to yield a crystal clear vulcanisate of medium hardness and with very high transmission. Special features. two-part system, 9:1 mixing ratio. low viscosity. rapid heat cure. [See More]

  • Industry: Optical; Photonics; OEM or Industrial; Photovoltaics
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Compound Type: Encapsulant, Potting Compound
  • Features: High Dielectric
Silicone Compound -- RTV 400-900
from Novagard Solutions

Non-corrosive, single component silicone compound, non-flowable [See More]

  • Industry: Electronics; Electric Power; Optical; Photonics; OEM or Industrial
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Compound Type: Sealant
  • Composition: Unfilled
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
  • Substrate Compatibility: Metal