Semiconductors / IC Packaging Silicone Adhesives and Sealants Datasheets

Flexible,Fast Curing Silicone for Medical Device Assemblies -- MasterSil 910Med
from Master Bond, Inc.

Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Composition: Unfilled
1987166 [88318 from Henkel Corporation - Industrial]
from RS Components, Ltd.

Tempflex is a non-corrosive single part RTV silicone sealant specifically designed for use on corrosion sensitive metallic surfaces. Trade Name = Loctite 5145 TEMPFLEX. Package Type = Tube. Package Size = 40 ml. Cure Time = 72 h. Number of Parts = 1. Thermal Conductivity = 0.2W/mK. Colour =... [See More]

  • Industry: Semiconductors, IC's
  • Use Temperature: 392
  • Compound Type: Adhesive
  • Thermal Conductivity: 0.2000
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Metal; Plastic