Gap Pad VO Soft® [Gap Pad VO Soft® from Bergquist Company (The)]
from Quist Electronics

Enhanced puncture, shear and tear resistance, electrically isolating [See More]

  • Industry: Electronics; Semiconductors, IC's; Telecommunications, Power Conversion
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
  • Compound Type: Leveling Filling; Thermally Conductive
  • Composition: Filled
Grease Heat Sink Tube -- CT40-5 [CT40-5 from ITW Chemtronics]
from All-Spec Industries

The CircuitWorks CT40-5 tube dispenser is for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Substrate Compatibility: Electronics and Electrical Components
  • Compound Type: Thermally Conductive
  • Cure / Technology: Single Component
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Metal; Plastic