Gap Pad VO Soft® [Gap Pad VO Soft® from Bergquist Company (The)]
from Quist Electronics

Enhanced puncture, shear and tear resistance, electrically isolating [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
  • Composition: Filled
  • Compound Type: Leveling Filling; Thermally Conductive
  • Cure / Technology: Thermoset; Contact or Pressure Sensitive Adhesives
Silicone Transfer Adhesive -- TRANS-SIL NT-1001
from Dielectric Polymers, Inc.

High performance bonding and other application involving harsh environment [See More]

  • Substrate Compatibility: Composites; Metal; Plastic; Dissimilar Substrates
  • Composition: Unfilled
  • Compound Type: Adhesive
  • Cure / Technology: Contact or Pressure Sensitive Adhesives
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Composition: Unfilled
Silicon Rubber -- RTV 100-101
from Novagard Solutions

Single component, moisture cured silicone rubber, strong durable sealant [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Aluminum; Fiberglass
  • Composition: Unfilled
  • Compound Type: Sealant
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing