3M™ Silicone Thermal Interface Pad -- 5516
from 3M Electronics Design & Manufacturing

Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. Consists of highly conformable, slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles. [See More]

  • Cure / Technology: Contact or Pressure Sensitive Adhesives
  • Substrate Compatibility: Metal
  • Compound Type: Thermally Conductive; Adhesive
  • Features: UL Rating
Kapton Polymide Amber Masking Discs -- KD250-K [KP00250 from Shercon, Inc.]
from All-Spec Industries

x [See More]

  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
  • Substrate Compatibility: Circuit Boards
  • Compound Type: Adhesive
  • Features: High Dielectric; Thermal Insulation
Silicone Transfer Adhesive -- TRANS-SIL NT-1001
from Dielectric Polymers, Inc.

High performance bonding and other application involving harsh environment [See More]

  • Cure / Technology: Contact or Pressure Sensitive Adhesives
  • Substrate Compatibility: Composites; Metal; Plastic; Dissimilar Substrates
  • Compound Type: Adhesive
  • Composition: Unfilled