Thermal Interface Materials -- DTIM Series
from Device Technologies, Inc.

The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]

  • Composition: Filled
  • Type / Form: Gel
  • Compound Type: Thermally Conductive; Adhesive
  • Substrate Compatibility: Metal
Emerson & Cuming Stycast 5954 Silicone Red 1 gal Pail -- 5954 PTA RED 15LB
from Ellsworth Adhesives

STYCAST 5954 is a highly filled, addition cured silicone encapsulant; it has high thermal conductivity, excellent electrical insulation properties, is non-corrosive and reversion resistant. Sold as pack (4/pk). [See More]

  • Composition: Filled
  • Use Temperature: -85 to 500
  • Industry: Electronics; OEM or Industrial
  • Tensile (Break): 400
INSULCAST RTVS 12 General Purpose RTV Silicone Potting Compound
from ITW Polymer Technologies - Insulcast Division

RTVS 12 is a multi-purpose compound designed for use as an encapsulant, sealant, potting and mold making material. RTVS 12 exhibits excellent electrical properties, low temperature flexibility and high temperature stability. A variety of catalysts are available for different cure situations. (See... [See More]

  • Composition: Filled
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Plastic
Silver Filled, Non-Corrosive Silicone -- MS705S
from Master Bond, Inc.

Master Bond MasterSil 705S is an easy-to-use, one component, non-corrosive, electrically conductive, silver filled, silicone for bonding and sealing. The material is a gray colored paste. It cures readily at ambient temperatures when exposed to atmospheric moisture. MasterSil 705S features... [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Compound Type: Sealant; Adhesive
  • Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Non-corrosive
Gap Pad VO Soft® [Gap Pad VO Soft® from Bergquist Company (The)]
from Quist Electronics

Enhanced puncture, shear and tear resistance, electrically isolating [See More]

  • Composition: Filled
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
  • Compound Type: Leveling Filling; Thermally Conductive
  • Cure / Technology: Thermoset; Contact or Pressure Sensitive Adhesives
Aremco-Seal™ -- 4030
from Aremco Products, Inc.

Hi-temp, prevents dusting of fibrous insulation materials [See More]

  • Composition: Filled
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Substrate Compatibility: Ceramic, Glass
Circuit Board Protection -- 5084
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Composition: Filled
  • Type / Form: Liquid
  • Compound Type: Sealant
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Conductive Silicon Adhesive
from Metal Textiles Corporation

Metex conductive silicone adhesive is an RTV silicone [See More]

  • Composition: Filled
  • Cure / Technology: Room Temperature Vulcanizing or Curing
  • Compound Type: Adhesive
  • Features: Electrically Conductive
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Composition: Filled
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
  • Substrate Compatibility: Metal