Dow Corning 3-4130 Dielectric Gel 210ml Kit -- 3-4130 DIE GEL 210ML KIT
from Ellsworth Adhesives

Dow Corning brand dielectric gels are supplied as solvent free, typically low-viscosity liquids. Two-part gels offer more processing flexibility with the options of room-temperature or heat-accelerated cure. Documentation: Dow Corning MSDS/TDS [See More]

  • Features: High Dielectric
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound
  • Composition: Unfilled
0Room Temperature Curing Silicone Elastomer -- MS701
from Master Bond, Inc.

Master Bond Master Sil 701 is a ready-to-use, one component, high performance silicone elastomer compound for bonding, and sealing protective coatings and formed-in-place gaskets. This compound has a paste consistency and will not sag, slump or run off surfaces. It cures at ambient temperatures to a... [See More]

  • Features: Flexible; High Dielectric
  • Substrate Compatibility: Metal; Plastic
  • Compound Type: Sealant; Adhesive
  • Composition: Unfilled
High Thermally Conductive Paste -- OMEGATHERM® OT-201 Series
from OMEGA Engineering, Inc.

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

  • Features: High Dielectric
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
  • Cure / Technology: Single Component
Conformal Coating -- SEMICOSIL® 936 UV
from Wacker Chemical Corp.

SEMICOSIL ® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features. Rapid UV acceleration. Shadow cure. solvent free. Application. SEMICOSIL ® 936 UV is intended as a protective coating... [See More]

  • Features: High Dielectric
  • Cure / Technology: Thermoset; UV or Radiation Cured (optional feature); Single Component; Reactive or Moisture Cured (optional feature); Room Temperature Vulcanizing or Curing
  • Type / Form: Liquid
  • Industry: Automotive; Electronics
Kapton Polymide Amber Masking Discs -- KD250-K [KP00250 from Shercon, Inc.]
from All-Spec Industries

x [See More]

  • Features: High Dielectric; Thermal Insulation
  • Substrate Compatibility: Circuit Boards
  • Compound Type: Adhesive
  • Cure / Technology: Contact or Pressure Sensitive Adhesives; Single Component
Aremco-Seal™ -- 4030
from Aremco Products, Inc.

Hi-temp, prevents dusting of fibrous insulation materials [See More]

  • Features: High Dielectric
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Substrate Compatibility: Ceramic, Glass
Potting, Encapsulant Elastomer -- Bluesil™ Esa 7252 QC A/B
from Bluestar Silicones USA Corp.

Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]

  • Features: High Dielectric
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Features: Flexible; High Dielectric; Non-corrosive; UL Rating
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
Hysol® Die Attach Adhesive -- QMI 282HT
from Henkel Corporation - Electronics

Withstands polymer decomposition during reflow [See More]

  • Features: High Dielectric
  • Type / Form: Gel
  • Compound Type: Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Cu, Pd, Ag, and Au Plating
Silastomers® -- 333
from Hernon Manufacturing, Inc.

HERNON Silastomer ® sealants are high performance, single component, moisture curing RTV (room temperature vulcanizing) silicone gasketing materials that cure into a strong, silicone rubber that maintains long term durability and flexibility. They have a non-slumping, paste-like consistency,... [See More]

  • Features: High Dielectric; Non-corrosive; Phase Change; Thermal Insulation
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Wood; Dissimilar Substrates
  • Compound Type: Sealant; Thermally Conductive; Adhesive
  • Composition: Unfilled
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Features: High Dielectric; Non-corrosive
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal
Silicone Encapsulant -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Features: Flexible; High Dielectric; Flame Retardant; UL Rating
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic