Encapsulating / Potting Silicone Adhesives and Sealants Datasheets

3110 RTV Silicone Rubber -- 3110 453G [3110 453G from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

453 g Tub; Use As A Flexible Potting & Encapsulating Material [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Industry: General Purpose
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing; Cure By Methanol
  • Use Temperature: -65 to 390
Dow Corning 3-4680 Silicone Gel Transparent Blue 210 mL Kit -- 3-4680 SILICONE GEL 210ML [4027868 from Dow Corning Oil & Gas Solutions]
from Ellsworth Adhesives

Dow Corning 3-4680 Silicone Gel Clear-Blue is a two component, room temperature curing, low viscosity, dielectric gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, and fast curing. 1:1 mix... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Two Component  
High Thermally Conductive Paste -- OMEGATHERM® OT-201 Series
from OMEGA Engineering, Inc.

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
  • Cure / Technology: Single Component
  • Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
  • Features: High Dielectric
LOCTITE 5088 300ML CRTG; FLOWABLE UV SILICONE -- 079340-17614
from R. S. Hughes Company, Inc.

LOCTITE 5088 300ML CRTG; FLOWABLE UV SILICONE. [See More]

  • Compound Type: Encapsulant, Potting Compound; Adhesive
Fluoro Silicone Gel -- SEMICOSIL® 927 F
from Wacker Chemical Corp.

SEMICOSIL ® 927F is a pourable, thermally curable, addition-curing, one-part fluoro silicone rubber that cures to a soft silicone gel. Special characteristics. One-part, ready-to-use. Thixotropic behavior. Rapid heat cure. Very low hardness (gel). Outstanding resistance to chemicals. [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Industry: Electronics
  • Cure / Technology: Thermoset; Single Component
  • Viscosity: 2500 to 6000
Silicone; hi temp; encapsulating & sealing; red paste; 3 oz cartridge -- 70125880 [RTV106-85ML from MG Chemicals]
from Allied Electronics, Inc.

Specific Gravity 1.07, Red, RTV Silicone Adhesive Sealant. Offering higher performance qualities over conventional RTV silicones. MG Chemicals sealants will bond to many clean surfaces without the aid of primers. Many of these one-part RTV silicone adhesive sealants are suitable for assembly... [See More]

  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant
  • Use Temperature: -76 to 500
  • Features: UL Rating
  • Thermal Conductivity: 0.2092
Aremco-Seal™ -- 4030
from Aremco Products, Inc.

Hi-temp, prevents dusting of fibrous insulation materials [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Substrate Compatibility: Ceramic, Glass
  • Type / Form: Liquid
  • Composition: Filled
Heat Curing Electronic Coating Silicone Compound -- Bluesil™ V-207
from Bluestar Silicones USA Corp.

Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset; Two Component  ; Reactive or Moisture Cured
  • Type / Form: Liquid
  • Industry: Electronics
Thermally Conductive Silicone Rubber -- 50-1225
from Epoxies Etc...

50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. [See More]

  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive
  • Composition: Unfilled
  • Type / Form: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
101697 [1673921 from Dow Corning Analytical Solutions]
from Farnell Europe

ELASTOMER, 184, KIT, 1.1KG [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Use Temperature: -67 to 392
  • Viscosity: 4000
  • Tensile (Break): 899
7024™ Dielectric Gel
from Glotrax Polymers Inc.

A two part dielectric gel with a one to one mix ratio, low viscosity, primeless adhesion, good dielectric properties, tough elatomeric gel, designed for use with automated dispensing equipment. Gel may be either room temperature or heat cured, room temperature cured gels may also be heat accelerated... [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
  • Type / Form: Gel
  • Composition: Unfilled
INSULCAST 42 Silicone-Epoxy Co-Polymer, Room Temperature Cure, Potting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 42 is a low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, low moisture absorption and excellent dielectric insulation. INSULCAST 42 bonds well to most metals and plastics. [See More]

  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset; Two Component  
  • Substrate Compatibility: Metal; Plastic
  • Features: High Dielectric; Flame Retardant
Silicone Coating -- RTV 200-250
from Novagard Solutions

Non-corrosive, single component silicone coating & encapsulating compound [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal
  • Type / Form: Liquid
  • Composition: Unfilled
Clear Non-Yellowing Silicone Encapsulant -- PNS-20100
from Protavic America, Inc.

PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]

  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Metal; Plastic
  • Type / Form: Liquid
  • Composition: Unfilled